M1A3P600-2PQ208

The M1A3P600-2PQ208 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, delivering flash-based programmable logic in a 208-pin BFQFP package. The device provides 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 154 I/O pins in a surface-mount 208-PQFP (28×28) footprint for commercial embedded designs.

Targeted at designers who need on-chip memory, moderate logic density and a compact package, this device combines programmable gate capacity with a narrow core voltage range and commercial temperature rating for predictable deployment in commercial applications.

Key Features

• Logic Capacity — 13,824 logic elements (reported as Number Of Logic Elements Cells) supporting up to 600,000 user gates for implementing moderate-complexity digital designs.
• Embedded Memory — 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for data buffering, state storage and small lookup tables.
• I/O — 154 I/O pins to support multiple interfaces and board-level connectivity requirements.
• Power Supply Range — Core voltage specified between 1.425 V and 1.575 V to match platform power budgets and regulator design.
• Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for high-density PCB assembly.
• Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial-environment deployments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.
• Family Technology (series) — Part of the ProASIC3 family, which includes flash-based devices and Flash*Freeze technology as described in the ProASIC3/EL family documentation.

Typical Applications

• Commercial Embedded Systems — Implement control logic, I/O routing and protocol adaptation where a commercial-temperature programmable device is appropriate.
• Interface Bridging and I/O Expansion — Use the 154 I/O pins to consolidate multiple peripheral interfaces or provide board-level signal aggregation.
• Prototyping and Proof-of-Concept — Deployable in development platforms that require reconfigurable logic with on-chip RAM and a compact PQFP package.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and 600,000 gates offer a mid-range programmable fabric suitable for complex glue logic and subsystem implementations without excessive cost or board area.
• On-Chip Memory: 110,592 bits of embedded RAM reduce the need for external memory for small buffers and state storage, simplifying BOM and layout.
• Generous I/O Count: 154 I/Os provide flexibility to interface with multiple peripherals and sensors directly on the FPGA.
• Compact, Surface-Mount Package: 208-PQFP (28×28) enables high-density PCB placement while maintaining a standardized package footprint for assembly.
• Commercial-Grade Deployment: Specified for 0 °C to 85 °C operation, suitable for typical commercial environments and product designs.
• Standards-Friendly Compliance: RoHS compliance facilitates integration into lead-free manufacturing processes.

Why Choose M1A3P600-2PQ208?

The M1A3P600-2PQ208 positions itself as a practical, flash-based ProASIC3 FPGA option for commercial embedded designs that require mid-level logic capacity, embedded RAM, and a substantial I/O count in a compact 208-pin PQFP package. Its defined core voltage window and commercial temperature grade make it suitable for predictable system-level integration where flash-based configuration and reprogrammability are desired.

This device is appropriate for engineering teams seeking a balance of logic, memory and I/O without stepping into larger package families; it offers scalable integration within the ProASIC3 family and aligns with RoHS-compliant production processes.

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