M1A3P600-2FGG484I

The M1A3P600-2FGG484I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides programmable logic with 13,824 logic elements and approximately 0.11 Mbits of on-chip RAM, together with 235 user I/Os in a compact 484-BGA package.

Designed for industrial-grade deployments, this surface-mount FPGA supports a 1.425 V to 1.575 V core supply and an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require moderate logic capacity, significant I/O, and extended temperature operation.

Key Features

• Logic Capacity  13,824 logic elements (cells) providing approximately 600,000 equivalent gates for implementing custom logic, control state machines, and glue logic.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) to support buffering, small data stores, and register files within designs.
• I/O Density  235 user I/O pins to support wide parallel interfaces, multiple peripheral connections, and flexible board-level signal routing.
• Power  Specified core voltage supply range of 1.425 V to 1.575 V to match system power rails and ensure consistent core operation.
• Package & Mounting  484-ball BGA in a 484-FPBGA (23 × 23) format, surface-mount package for high-density PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet the needs of industrial and harsh-environment applications.
• Compliance  RoHS compliant for environmental compliance in manufacturing and deployment.

Typical Applications

• Industrial Control and Automation  Use the FPGA’s logic capacity and wide I/O count to implement motor control logic, I/O aggregation, and custom protocol handling in industrial equipment running across extended temperature ranges.
• Communications and Networking Equipment  Deploy for parallel interface handling, packet buffering, and protocol bridging where multiple I/Os and embedded RAM are required.
• Instrumentation and Test Equipment  Implement custom timing, data capture, and signal routing functions leveraging the available logic elements and I/O density in a compact BGA footprint.

Unique Advantages

• Balanced Logic and Memory  Combines 13,824 logic elements with approximately 0.11 Mbits of embedded RAM to support control logic alongside modest local data storage without external memory.
• High I/O Count  235 user I/Os enable direct interfacing to a broad set of peripherals and sensors, reducing the need for external I/O expanders.
• Industrial Reliability  Rated for −40 °C to 100 °C operation and listed as industrial grade, aligning with deployment requirements in demanding environments.
• Compact, PCB-Friendly Package  484-BGA (484-FPBGA, 23 × 23) surface-mount package offers a compact form factor for dense board designs while preserving signal routing options.
• Low-Voltage Core Operation  Narrow core supply range (1.425 V to 1.575 V) simplifies power-supply design for systems targeting this voltage domain.
• Environmental Compliance  RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Why Choose M1A3P600-2FGG484I?

The M1A3P600-2FGG484I delivers a practical combination of logic density, embedded memory, and extensive I/O in a compact 484-BGA package, targeted for industrial applications that demand programmable logic with extended temperature capability. Its specified voltage range, RoHS compliance, and surface-mount package make it suitable for designers seeking a reliable FPGA option from Microchip Technology for medium-density FPGA tasks.

This device is appropriate for engineers and procurement teams building industrial controls, communications interfaces, or instrumentation systems where on-chip logic, significant I/O, and industrial operating range are required.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3P600-2FGG484I.