M1A3P600-2FGG144I

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 110592 144-LBGA

Quantity 694 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-2FGG144I – ProASIC3 FPGA, 97 I/Os, 144-LBGA

The M1A3P600-2FGG144I is a ProASIC3 series flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a reprogrammable, nonvolatile FPGA fabric with a balance of logic capacity, on-chip memory, and mixed-voltage I/O for system-level integration in industrial applications.

This device is suited to designs requiring instant-on nonvolatile configuration, flexible I/O interfacing, and a compact 144-LBGA package. Key value propositions include secure in-system programming, on-chip memory resources, and industrial temperature operation.

Key Features

  • Logic Capacity — 13,824 logic elements delivering approximately 600,000 system gates for mid-density FPGA designs.
  • On-Chip Memory — 110,592 bits of embedded RAM available for user logic and buffering; includes 1 kbit of on-chip FlashROM for nonvolatile storage (as described for the ProASIC3 family).
  • I/O and Flexibility — 97 user I/O pins with support for mixed-voltage operation and a variety of single-ended and differential I/O standards described for the family.
  • Clocking and PLLs — Integrated clock conditioning circuitry with Phase-Locked Loop (PLL) support to implement configurable clocking and phase shift capabilities (family-level feature).
  • Security and In-System Programming — Supports secure in-system programming workflows with on-chip AES decryption for encrypted bitstreams (family-level feature).
  • Power and Supply — Core supply range of 1.425 V to 1.575 V for low-power core operation.
  • Package and Mounting — 144-LBGA (144-FPBGA, 13×13) surface-mount package optimized for compact board footprints.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C for industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Instant-on Control Systems — Nonvolatile flash configuration enables systems that require immediate availability after power-up.
  • Secure In-System Updates — Encrypted in-system programming workflows protect FPGA configuration in deployed equipment.
  • Mixed-Voltage Interface Designs — Flexible I/O and bank-selectable voltages support interfacing to diverse logic families and external devices.

Unique Advantages

  • Nonvolatile, Reprogrammable Configuration: Flash-based architecture retains programmed design when powered off, simplifying boot and system management.
  • Balanced Logic and Memory: 13,824 logic elements combined with 110,592 bits of embedded RAM enable mid-density designs with on-chip buffering and state storage.
  • Secure Deployment: Family-level AES-based in-system programming provides a mechanism to protect bitstreams during field updates.
  • Industrial Robustness: Rated for −40°C to 100°C operation and supplied in a compact 144-LBGA package for reliable use in industrial applications.
  • Flexible Clocking: Integrated clock conditioning and PLL capabilities support multiple clocking schemes required by synchronous designs.

Why Choose M1A3P600-2FGG144I?

The M1A3P600-2FGG144I offers a pragmatic combination of logic capacity, embedded memory, and secure flash-based configuration in a compact industrial-grade package. It is targeted at designs that require nonvolatile instant-on behavior, flexible I/O, and robust field programmability.

Engineers selecting this device benefit from a field-proven ProASIC3 family architecture with on-chip FlashROM, clock conditioning, and secure in-system programming options—providing long-term design scalability and deployment flexibility.

If you would like pricing, availability, or to submit a quote request for M1A3P600-2FGG144I, please request a quote or contact sales through your usual purchasing channels.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up