M1A3P600-2PQ208I

The M1A3P600-2PQ208I is a ProASIC3 family flash-based FPGA designed for industrial applications. It delivers a flash FPGA architecture with Flash*Freeze technology and provides a balanced combination of logic capacity, embedded memory, and I/O to implement custom digital functions in a surface-mount 208-BFQFP package.

This device is targeted at embedded and industrial markets that require moderate gate density, substantial programmable logic (13,824 logic elements), and flexible interfacing (154 I/Os), while operating across a wide temperature range and a defined core voltage range.

Key Features

• Logic Capacity — 600,000 gates implemented as 13,824 logic elements for implementing mid-density digital designs.
• Embedded Memory — 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for FIFOs, buffering, and state storage.
• I/O Density — 154 user I/Os providing broad external connectivity for sensors, peripherals, and buses.
• Power and Core Voltage — Specified core supply range of 1.425 V to 1.575 V to support stable operation within the device's power envelope.
• Package & Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for PCB integration in space-constrained assemblies.
• Operating Range & Grade — Industrial grade with operating temperature from −40 °C to 100 °C for industrial embedded environments.
• Low-Power Flash Technology — Flash-based configuration with Flash*Freeze technology as part of the ProASIC3 family (as documented in the device datasheet).
• Environmental Compliance — RoHS compliant for reduced hazardous substance content in assembly.

Typical Applications

• Industrial Control — Implement control logic, protocol bridging, and custom I/O handling in factory automation and machine control systems using the device's logic and I/O resources.
• Communications Equipment — Use for packet handling, interface adaptation, and protocol glue logic where mid-range logic density and embedded RAM are required.
• Data Acquisition & Instrumentation — Integrate signal preprocessing, data buffering, and timing logic for instrumentation and test systems leveraging on-chip RAM and abundant I/O.
• Aerospace & Defense Systems — Suitable for non-safety-critical aerospace and defense applications requiring flash-based configuration and industrial temperature operation as described in the product datasheet.

Unique Advantages

• High Logic Density: 600k gates and 13,824 logic elements enable complex custom logic implementations without external glue logic.
• Ample On-Chip RAM: 110,592 bits of embedded memory support buffering, FIFOs, and small data stores directly on the FPGA fabric.
• Extensive I/O: 154 user I/Os simplify system integration by reducing the need for external interface components.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding embedded environments.
• Flash-Based Configuration: Flash*Freeze technology provides non-volatile configuration and low-power benefits characteristic of ProASIC3 flash FPGAs.
• Board-Level Compatibility: 208-BFQFP surface-mount package (28×28) enables straightforward PCB assembly and reflow-compatible integration.

Why Choose M1A3P600-2PQ208I?

The M1A3P600-2PQ208I positions itself as a practical mid-density flash FPGA solution for industrial embedded designs that need a balance of logic capacity, embedded memory, and plentiful I/O in a compact surface-mount package. Its specified voltage range and industrial temperature rating make it suitable for systems that require stable operation across extended environmental conditions.

Designers and procurement teams seeking a flash-configured FPGA with documented Flash*Freeze support, RoHS compliance, and clear electrical and mechanical specifications will find this device appropriate for applications where non-volatile configuration and on-chip resources reduce system complexity and external component count.

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