M1A3P600-FG484I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA |
|---|---|
| Quantity | 444 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 235 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600-FG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC
The M1A3P600-FG484I is a ProASIC3 FPGA from Microchip Technology, delivering mid-range programmable logic resources in a compact BGA package. It provides 13,824 logic elements and approximately 600,000 gates alongside on-chip memory and a high I/O count, targeting industrial embedded designs that require reconfigurable digital logic with extended temperature capability.
Available in a 484-FPBGA (23×23) surface-mount package, the device operates from 1.425 V to 1.575 V and is qualified for operation from -40 °C to 100 °C. The part is RoHS compliant.
Key Features
- Core logic: 13,824 logic elements providing approximately 600,000 gates for mid-density programmable logic implementations.
- Embedded memory: 110,592 bits of on-chip RAM (approximately 0.11 Mbits) to support local data storage and buffering without external memory in many designs.
- I/O capacity: 235 dedicated I/O pins to accommodate a wide range of external interfaces and signal routing requirements.
- Supply voltage: Nominal operating voltage range of 1.425 V to 1.575 V for core power planning and power-supply design.
- Package and mounting: 484-FPBGA (23×23) / 484-BGA package in a surface-mount form factor for dense PCB integration.
- Operating temperature & grade: Industrial grade with an operating range of -40 °C to 100 °C for use in temperature-challenging environments.
- Environmental compliance: RoHS compliant.
Unique Advantages
- Mid-range logic density: 13,824 logic elements and ~600,000 gates provide a balanced trade-off of capacity and cost for many embedded logic functions.
- On-chip memory reduces external components: 110,592 bits of embedded RAM enable local buffering and temporary storage, helping simplify board-level memory requirements.
- High I/O count: 235 I/O pins allow consolidation of multiple interfaces and reduce the need for external I/O expanders.
- Compact BGA footprint: 484-FPBGA (23×23) package supports dense PCB layouts while maintaining robust electrical connections.
- Industrial temperature capability: Rated for -40 °C to 100 °C operation, suitable for deployments exposed to wide temperature ranges.
- Low-voltage core operation: 1.425 V–1.575 V supply range supports modern low-voltage system architectures.
Why Choose M1A3P600-FG484I?
The M1A3P600-FG484I positions itself as a practical choice for engineers who need a mid-density, industrial-grade FPGA in a compact BGA package. Its combination of 13,824 logic elements, substantial I/O count, and on-chip RAM makes it suitable for embedded systems that require reconfigurable logic, local memory, and a high degree of I/O integration.
Designed for durability across an extended temperature range and packaged for dense PCB integration, this device offers a balance of integration and reliability for industrial applications where programmable logic and controlled supply requirements are important design criteria.
Request a quote or submit a quote for the M1A3P600-FG484I to receive pricing and availability information for your project needs.

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