M1A3P600-FG484I

IC FPGA 235 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

Quantity 444 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O235Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600-FG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC

The M1A3P600-FG484I is a ProASIC3 FPGA from Microchip Technology, delivering mid-range programmable logic resources in a compact BGA package. It provides 13,824 logic elements and approximately 600,000 gates alongside on-chip memory and a high I/O count, targeting industrial embedded designs that require reconfigurable digital logic with extended temperature capability.

Available in a 484-FPBGA (23×23) surface-mount package, the device operates from 1.425 V to 1.575 V and is qualified for operation from -40 °C to 100 °C. The part is RoHS compliant.

Key Features

  • Core logic: 13,824 logic elements providing approximately 600,000 gates for mid-density programmable logic implementations.
  • Embedded memory: 110,592 bits of on-chip RAM (approximately 0.11 Mbits) to support local data storage and buffering without external memory in many designs.
  • I/O capacity: 235 dedicated I/O pins to accommodate a wide range of external interfaces and signal routing requirements.
  • Supply voltage: Nominal operating voltage range of 1.425 V to 1.575 V for core power planning and power-supply design.
  • Package and mounting: 484-FPBGA (23×23) / 484-BGA package in a surface-mount form factor for dense PCB integration.
  • Operating temperature & grade: Industrial grade with an operating range of -40 °C to 100 °C for use in temperature-challenging environments.
  • Environmental compliance: RoHS compliant.

Unique Advantages

  • Mid-range logic density: 13,824 logic elements and ~600,000 gates provide a balanced trade-off of capacity and cost for many embedded logic functions.
  • On-chip memory reduces external components: 110,592 bits of embedded RAM enable local buffering and temporary storage, helping simplify board-level memory requirements.
  • High I/O count: 235 I/O pins allow consolidation of multiple interfaces and reduce the need for external I/O expanders.
  • Compact BGA footprint: 484-FPBGA (23×23) package supports dense PCB layouts while maintaining robust electrical connections.
  • Industrial temperature capability: Rated for -40 °C to 100 °C operation, suitable for deployments exposed to wide temperature ranges.
  • Low-voltage core operation: 1.425 V–1.575 V supply range supports modern low-voltage system architectures.

Why Choose M1A3P600-FG484I?

The M1A3P600-FG484I positions itself as a practical choice for engineers who need a mid-density, industrial-grade FPGA in a compact BGA package. Its combination of 13,824 logic elements, substantial I/O count, and on-chip RAM makes it suitable for embedded systems that require reconfigurable logic, local memory, and a high degree of I/O integration.

Designed for durability across an extended temperature range and packaged for dense PCB integration, this device offers a balance of integration and reliability for industrial applications where programmable logic and controlled supply requirements are important design criteria.

Request a quote or submit a quote for the M1A3P600-FG484I to receive pricing and availability information for your project needs.

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