M1A3P600-PQ208I

The M1A3P600-PQ208I is a ProASIC3/EL low-power flash FPGA from Microchip Technology provided in a 208-BFQFP surface-mount package. It delivers 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 154 user I/O pins for mid-density programmable logic tasks.

Designed as part of the Military ProASIC3/EL family, this industrial-grade device supports a supply range of 1.425 V to 1.575 V and an operating temperature range of −40°C to 100°C. The device leverages flash-based operation with Flash*Freeze technology for low-power operation and retention as described in the product family datasheet.

Key Features

• Logic Capacity  13,824 logic elements and approximately 600,000 gates provide a mid-density fabric for custom logic implementation and glue-logic integration.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, state storage, and small data structures.
• I/O  154 user I/O pins to support multiple external interfaces and peripheral connections.
• Low-Power Flash Architecture  Part of the Military ProASIC3/EL low-power flash FPGA family with Flash*Freeze technology (family-level feature referenced in the datasheet).
• Power Supply  Operates from a narrow low-voltage rail: 1.425 V to 1.575 V.
• Package & Mounting  208-BFQFP surface-mount package; supplier device package listed as 208-PQFP (28×28).
• Industrial Temperature & Grade  Industrial-grade device with an operating range of −40°C to 100°C.
• Standards Compliance  RoHS compliant.

Typical Applications

• Aerospace & Defense  Military ProASIC3/EL family association makes this device applicable for defense and aerospace projects requiring flash-based FPGA logic in industrial temperature environments.
• Communications Equipment  Mid-density logic and 154 I/O pins support protocol adaptation, signal aggregation, and custom interface logic in communications hardware.
• Data Center and Industrial Systems  Embedded RAM and logic density enable board-level acceleration, glue logic, and control functions where industrial temperature operation is required.
• Embedded Control  Compact package and low-voltage operation suit embedded systems that need programmable logic with on-chip memory and a moderate I/O count.

Unique Advantages

• Scalable mid-density logic: 13,824 logic elements and ~600,000 gates provide a balance between capacity and cost for moderate-complexity designs.
• On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for small data and state storage.
• Industrial temperature tolerance: −40°C to 100°C operation supports deployment in demanding environments.
• Compact surface-mount packaging: 208-BFQFP (208-PQFP, 28×28) delivers a high-pin-count implementation in a board-space-efficient SMD form factor.
• Low-voltage operation: 1.425 V to 1.575 V supply range aligns with modern low-voltage system rails.
• Flash-based low-power family: Part of the ProASIC3/EL low-power flash FPGA family with Flash*Freeze technology for flash-based configuration and low-power retention behavior (family-level attribute).

Why Choose M1A3P600-PQ208I?

The M1A3P600-PQ208I positions itself as a mid-density, industrial-grade flash FPGA option within the Military ProASIC3/EL family. Its combination of 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 154 I/O pins supports a broad set of board-level programmable logic tasks while maintaining low-voltage operation and wide operating temperatures.

This device is suited to engineers and procurement teams building aerospace, defense, communications, data center, or industrial equipment that requires flash-based FPGA logic in a compact surface-mount package. The product’s family-level low-power flash attributes and industrial ratings support long-term use in deployed systems where stability and temperature tolerance are required.

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