M1A3P600L-1FG144I

The M1A3P600L-1FG144I is a ProASIC3L Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a balanced mid-range FPGA architecture with substantial logic capacity, on-chip memory, and a high count of general-purpose I/O for industrial applications.

Designed for surface-mount deployment in a compact 144-LBGA footprint, this device targets designs that require moderate logic density, significant I/O, low-voltage operation, and industrial temperature capability.

Key Features

• Logic Capacity  Contains 13,824 logic elements, delivering approximately 600,000 gates for implementing complex combinational and sequential logic.
• Embedded Memory  Includes 110,592 bits of on-chip RAM—approximately 0.11 Mbits—suitable for small buffers, FIFOs, and control state storage.
• I/O Resources  Provides 177 user I/O pins to support a wide range of peripheral and interface connections.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.575 V to match low-voltage system domains.
• Package & Mounting  Supplied in a 144-LBGA package (supplier device package: 144-FPBGA, 13×13) and intended for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, making it suitable for temperature-challenging environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Leverage the industrial temperature rating and high I/O count to implement control logic, sensor interfacing, and distributed automation functions.
• Embedded Processing  Use the 13,824 logic elements and on-chip RAM for custom peripheral offload, state machines, and protocol handling in embedded systems.
• Interface Aggregation  The 177 I/O pins allow aggregation and bridging of multiple low- to mid-speed interfaces in compact system designs.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and ~600,000 gates provide room for moderately complex designs without excessive board-level area.
• Compact, Surface-Mount Package: 144-LBGA (13×13 FPBGA) packaging enables dense board layouts while preserving ample I/O.
• Wide I/O Count: 177 I/O pins support multi-signal systems and flexible peripheral connectivity.
• Low-Voltage Compatibility: Core voltage range of 1.14 V to 1.575 V aligns with modern low-voltage power domains.
• Industrial Reliability: Rated for −40 °C to 100 °C operation for deployment in temperature-demanding environments.
• Standards Compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose M1A3P600L-1FG144I?

The M1A3P600L-1FG144I positions itself as a practical, mid-range FPGA option for designers who need a mix of logic capacity, embedded memory, and extensive I/O in a compact surface-mount package. Its operating voltage range and industrial temperature rating make it suitable for equipment that must run reliably across varied environments.

This Microchip Technology ProASIC3L device is a solid choice for embedded and industrial-focused projects that require scalable logic, moderate on-chip memory, and a high pin count while maintaining a compact PCB footprint and RoHS compliance.

Request a quote today to obtain pricing and availability for the M1A3P600L-1FG144I.