M1A3P600L-1FG484

IC FPGA 235 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

Quantity 8 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O235Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600L-1FG484 – ProASIC3L Field Programmable Gate Array, 235 I/O, 484-BGA

The M1A3P600L-1FG484 is a ProASIC3L Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a mid-range programmable logic resource set with a balanced combination of logic elements, embedded memory, and a high I/O count in a compact 484-ball BGA package.

Intended for designers who need customizable digital logic, the device supports a broad range of embedded applications that require up to approximately 600,000 gates of logic and significant I/O integration while operating within commercial temperature and low-voltage supply constraints.

Key Features

  • Core Logic  13,824 logic elements provide the programmable fabric to implement custom logic functions and state machines in a single device.
  • Embedded Memory  Approximately 110.6 kbits of on-chip RAM to store lookup tables, FIFOs, and small data buffers close to the logic fabric.
  • I/O Capacity  235 user I/O pins enable extensive external interfacing and parallel connectivity for sensors, peripherals, and buses.
  • Gate Count  Designed to support designs requiring around 600,000 gates of logic integration.
  • Package & Mounting  484-ball FPBGA (23 × 23) surface-mount package (484-BGA) for compact board-level integration and dense routing.
  • Power  Supported voltage supply range from 1.14 V to 1.575 V to match system power rails and low-voltage designs.
  • Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

  • Embedded Systems  Implement custom control, sequencing, and glue logic where a moderate logic density and on-chip memory are required.
  • Prototyping & Evaluation  Validate custom digital architectures and I/O pinouts using a programmable device with a high I/O count.
  • Communications & Interface Logic  Bridge or adapt between multiple interfaces and perform protocol handling using the device’s logic fabric and I/O resources.
  • Consumer & General Electronics  Add flexible, application-specific logic to consumer devices where commercial temperature range and RoHS compliance are appropriate.

Unique Advantages

  • Balanced Logic Density:  13,824 logic elements enable substantial custom logic implementation without excessive device complexity.
  • Ample On-Chip Memory:  Approximately 110.6 kbits of embedded RAM reduce the need for external memory in many control and buffering tasks.
  • High I/O Count:  235 I/O pins give flexibility to connect multiple peripherals, sensors, or parallel buses directly to the FPGA.
  • Compact BGA Packaging:  484-ball FPBGA (23 × 23) offers a space-efficient footprint for dense PCB designs.
  • Low-Voltage Operation:  Support for 1.14 V to 1.575 V supplies helps integrate the FPGA into modern, low-voltage power domains.
  • Commercial Qualification & RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant to meet common manufacturing and environmental requirements.

Why Choose M1A3P600L-1FG484?

The M1A3P600L-1FG484 positions itself as a practical, mid-range ProASIC3L FPGA option for designers needing a blend of logic capacity, embedded memory, and a large number of I/Os in a compact, surface-mount package. Its voltage range and commercial temperature rating make it suitable for a wide set of general embedded and electronic applications.

Backed by Microchip Technology, this device is appropriate for teams seeking a programmable solution that scales to designs requiring up to approximately 600,000 gates, significant I/O integration, and on-chip memory for local buffering and state storage.

If you would like pricing, availability, or to request a quote for the M1A3P600L-1FG484, please submit an inquiry or request a quote through your preferred procurement channel.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up