M1A3P600L-1FG484
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA |
|---|---|
| Quantity | 8 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 235 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600L-1FG484 – ProASIC3L Field Programmable Gate Array, 235 I/O, 484-BGA
The M1A3P600L-1FG484 is a ProASIC3L Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a mid-range programmable logic resource set with a balanced combination of logic elements, embedded memory, and a high I/O count in a compact 484-ball BGA package.
Intended for designers who need customizable digital logic, the device supports a broad range of embedded applications that require up to approximately 600,000 gates of logic and significant I/O integration while operating within commercial temperature and low-voltage supply constraints.
Key Features
- Core Logic 13,824 logic elements provide the programmable fabric to implement custom logic functions and state machines in a single device.
- Embedded Memory Approximately 110.6 kbits of on-chip RAM to store lookup tables, FIFOs, and small data buffers close to the logic fabric.
- I/O Capacity 235 user I/O pins enable extensive external interfacing and parallel connectivity for sensors, peripherals, and buses.
- Gate Count Designed to support designs requiring around 600,000 gates of logic integration.
- Package & Mounting 484-ball FPBGA (23 × 23) surface-mount package (484-BGA) for compact board-level integration and dense routing.
- Power Supported voltage supply range from 1.14 V to 1.575 V to match system power rails and low-voltage designs.
- Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- Embedded Systems Implement custom control, sequencing, and glue logic where a moderate logic density and on-chip memory are required.
- Prototyping & Evaluation Validate custom digital architectures and I/O pinouts using a programmable device with a high I/O count.
- Communications & Interface Logic Bridge or adapt between multiple interfaces and perform protocol handling using the device’s logic fabric and I/O resources.
- Consumer & General Electronics Add flexible, application-specific logic to consumer devices where commercial temperature range and RoHS compliance are appropriate.
Unique Advantages
- Balanced Logic Density: 13,824 logic elements enable substantial custom logic implementation without excessive device complexity.
- Ample On-Chip Memory: Approximately 110.6 kbits of embedded RAM reduce the need for external memory in many control and buffering tasks.
- High I/O Count: 235 I/O pins give flexibility to connect multiple peripherals, sensors, or parallel buses directly to the FPGA.
- Compact BGA Packaging: 484-ball FPBGA (23 × 23) offers a space-efficient footprint for dense PCB designs.
- Low-Voltage Operation: Support for 1.14 V to 1.575 V supplies helps integrate the FPGA into modern, low-voltage power domains.
- Commercial Qualification & RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common manufacturing and environmental requirements.
Why Choose M1A3P600L-1FG484?
The M1A3P600L-1FG484 positions itself as a practical, mid-range ProASIC3L FPGA option for designers needing a blend of logic capacity, embedded memory, and a large number of I/Os in a compact, surface-mount package. Its voltage range and commercial temperature rating make it suitable for a wide set of general embedded and electronic applications.
Backed by Microchip Technology, this device is appropriate for teams seeking a programmable solution that scales to designs requiring up to approximately 600,000 gates, significant I/O integration, and on-chip memory for local buffering and state storage.
If you would like pricing, availability, or to request a quote for the M1A3P600L-1FG484, please submit an inquiry or request a quote through your preferred procurement channel.

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