M1A3P600L-1FGG144I

The M1A3P600L-1FGG144I is a ProASIC3L field programmable gate array from Microchip Technology designed for industrial embedded logic applications. It integrates 13,824 logic elements and approximately 0.11 Mbits of on-chip RAM to deliver moderate-density programmable logic and memory in a compact surface-mount LBGA package.

With 177 user I/Os, a supply voltage window of 1.14 V to 1.575 V, and an industrial operating temperature range of −40 °C to 100 °C, this device targets applications that require substantial I/O connectivity and robust environmental tolerance.

Key Features

• Core Logic  13,824 logic elements providing programmable logic capacity for custom digital functions and glue logic.
• Gate Equivalent  Approximately 600,000 gates, enabling moderate-density implementations requiring combinational and sequential resources.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) suitable for small buffers, FIFOs, and state storage.
• I/O Resources  177 user I/Os to support interface-rich designs and multiple peripheral connections.
• Power  Core voltage supply range from 1.14 V to 1.575 V for compatibility with targeted power domains.
• Package & Mounting  144‑LBGA (supplier package: 144‑FPBGA, 13×13) in a surface-mount form factor for compact board integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial temperature rating and industrial-grade specification make the device suitable for embedded logic in factory automation and control platforms.
• I/O‑dense interface bridging  High I/O count supports designs requiring multiple parallel interfaces, protocol translation, and board-level connectivity.
• Custom peripheral and glue logic  Logic capacity and on-chip RAM enable implementation of custom peripherals, timing engines, and data-handling blocks.
• Compact board-level FPGA integration  Surface-mount LBGA packaging allows dense placement on space-constrained PCBs for embedded systems.

Unique Advantages

• Substantial programmable logic: 13,824 logic elements and ~600,000 gate equivalents provide a balance of density for moderate-complexity designs.
• Embedded memory on-chip: Approximately 0.11 Mbits of RAM for local buffering and state storage without external memory.
• High I/O count: 177 user I/Os simplify integration with multiple peripherals and external interfaces, reducing the need for additional I/O expanders.
• Industrial operating range: Rated −40 °C to 100 °C for reliable operation in challenging environmental conditions.
• Compact, surface-mount LBGA package: 144‑LBGA (144‑FPBGA, 13×13) provides a small footprint for space-constrained designs while preserving thermal and electrical characteristics.
• Flexible core voltage: Support for 1.14 V to 1.575 V supply voltages to match target board power architectures.

Why Choose M1A3P600L-1FGG144I?

The M1A3P600L-1FGG144I positions itself as a practical solution for designers who need industrial-grade programmable logic with a strong mix of logic capacity, embedded memory, and a high number of I/Os in a compact LBGA package. Its specifications support I/O-heavy designs and embedded applications that must operate across a wide temperature range.

Backed by Microchip Technology, this ProASIC3L device is suited for customers focused on reliable, board-level FPGA integration where moderate logic density, local memory, and robust environmental tolerance are primary considerations.

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