M1A3P600L-FG144I

The M1A3P600L-FG144I is a ProASIC3L FPGA from Microchip Technology, delivered in a 144-ball L-BGA package. It provides reprogrammable logic resources and embedded memory in a compact, surface-mount package suited to industrial-temperature environments.

With 13,824 logic elements, 600,000 gates and 110,592 bits of on-chip RAM, this device addresses applications that require a moderate logic capacity, substantial I/O count and operation across a wide temperature and voltage range.

Key Features

• Logic Capacity  Approximately 13,824 logic elements enabling implementation of complex custom logic functions and moderate-scale system integration.
• Gate Count  600,000 gates for translating logic elements into practical design capacity.
• Embedded Memory  Approximately 0.11 Mbits of embedded memory (110,592 total RAM bits) for on-chip buffering and state storage.
• I/O  177 user I/Os to support dense external interfacing and system connectivity.
• Power Supply  Operates from a supply range of 1.14 V to 1.575 V to match low-voltage system rails.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board layouts.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant, supporting environmentally conscious designs.

Typical Applications

• Industrial Control  Use the FPGA for custom control logic, I/O aggregation and deterministic signal processing in industrial automation equipment.
• Communications Infrastructure  Implement protocol bridging, custom packet handling or interface adaptation leveraging the device's logic capacity and I/O density.
• Test & Measurement  Deploy for signal conditioning, data buffering and custom timing logic where on-chip memory and numerous I/Os are beneficial.
• Embedded Systems  Integrate custom peripherals or offload deterministic tasks from a host processor using the programmable fabric and embedded RAM.

Unique Advantages

• Substantial Programmable Fabric: 13,824 logic elements and 600,000 gates provide the resources to consolidate multiple discrete functions into a single device, reducing board-level BOM.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM enables local buffering and state retention without requiring external memory.
• High I/O Count: 177 user I/Os allow flexible connectivity to sensors, transceivers and peripherals, simplifying board routing and interface design.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments and temperature-variable installations.
• Compact, Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) offers a small PCB footprint for space-constrained designs.
• RoHS Compliant: Meets environmental compliance requirements for modern product assemblies.

Why Choose M1A3P600L-FG144I?

The M1A3P600L-FG144I delivers a balanced combination of logic density, embedded memory and I/O capacity in a compact industrial-grade package from Microchip Technology. Its supply voltage range and thermal rating make it suitable for systems that require low-voltage operation and extended temperature tolerance.

This device is well suited to engineers and OEMs looking to consolidate custom digital functions, implement interface logic or add deterministic processing to embedded platforms while maintaining a small PCB footprint and RoHS-compliant assembly.

Request a quote or submit an inquiry to obtain pricing and availability for the M1A3P600L-FG144I. Our team can provide lead-time and ordering information tailored to your project needs.