M1A3P600L-FGG144I

The M1A3P600L-FGG144I is a ProASIC3L series FPGA from Microchip Technology designed for industrial applications requiring mid-range logic capacity and on-chip memory. It integrates 13,824 logic elements and approximately 0.11 Mbits of embedded RAM to implement custom digital functions, with 177 user I/O pins for connectivity.

Built in a compact 144-LBGA package and rated for operation from -40 °C to 100 °C, this device provides a balance of integration density, I/O capability, and industrial temperature tolerance for embedded system designs.

Key Features

• Logic Capacity  13,824 logic elements (equivalent LAB/CLB count) and roughly 600,000 gates for implementing combinational and sequential logic structures.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for buffer, FIFO, and small data storage needs.
• I/O Density  177 user I/O pins to support a wide range of interfaces and external peripherals.
• Power Supply  Core voltage supply range from 1.14 V to 1.575 V to match system power-rail requirements.
• Package and Mounting  144-LBGA package (Supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Range  Qualified for operation from -40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, sequencing, and state machines for automation equipment and machine controllers.
• Embedded Processing  Offload glue logic and protocol handling in embedded systems that require mid-level logic density and on-chip RAM.
• Interface Bridging  Provide protocol conversion, signal conditioning, and I/O aggregation where numerous external connections are needed.

Unique Advantages

• Significant logic density: 13,824 logic elements and 600,000 gates enable substantial custom logic implementation without external ASIC development.
• On-chip memory: Approximately 0.11 Mbits of embedded RAM supports buffering and small data-handling functions directly in the FPGA fabric.
• High I/O count: 177 I/Os accommodate multiple interfaces and peripherals, reducing the need for external I/O expanders.
• Industrial qualification: Rated for -40 °C to 100 °C operation to meet industrial deployment temperature requirements.
• Compact surface-mount package: 144-LBGA (144-FPBGA, 13×13) offers a small PCB footprint for space-constrained designs.
• Low-voltage core operation: Core supply from 1.14 V to 1.575 V enables integration with modern low-voltage systems.

Why Choose M1A3P600L-FGG144I?

The M1A3P600L-FGG144I positions itself as a practical FPGA choice for designers who need a balanced combination of logic resources, embedded memory, and a high I/O count within an industrial temperature-rated package. Its specifications make it suitable for embedded and industrial control applications where mid-range gate density and on-chip RAM simplify system architecture.

As part of Microchip Technology's ProASIC3L family, this device offers predictable integration for designs that require moderate logic capacity and robust environmental tolerance, providing a straightforward path for deployment in industrial systems.

Request a quote or submit a request for pricing and availability to evaluate the M1A3P600L-FGG144I for your next design.