M1A3P600L-FG484

IC FPGA 235 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

Quantity 1,766 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / CaseTrayNumber of I/O235Voltage1.14 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits108000

Overview of M1A3P600L-FG484 – ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

The M1A3P600L-FG484 is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a mid-density programmable fabric with a defined logic element count, embedded memory and a high I/O count for system integration.

Designed for commercial applications, this device combines 13,824 logic elements with approximately 0.108 Mbits of embedded memory, supporting designs that require up to 600,000 gates and up to 235 I/Os in a compact 484-FPBGA (23×23) package.

Key Features

  • Core Logic  13,824 logic elements (cells) provide the programmable fabric capacity for custom logic and state machines.
  • Embedded Memory  Approximately 0.108 Mbits of on-chip RAM for buffers, FIFOs and small data stores within the FPGA fabric.
  • I/O Count  235 I/O pins to support broad connectivity to peripherals, interfaces and external devices.
  • Logic Density  Up to 600,000 gates of equivalent logic capacity for medium-complexity digital designs.
  • Power Supply  Single-core supply defined at 1.14 V, enabling consistent power planning for the FPGA fabric.
  • Package & Mounting  484-FPBGA (23×23) ball-grid array in a surface-mount form factor; devices supplied in tray packaging for automated assembly.
  • Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C for typical commercial environments.

Unique Advantages

  • High Logic Capacity: 13,824 logic elements deliver substantial programmable resources for implementing complex control and processing functions.
  • Generous I/O Availability: 235 I/Os enable flexible interfacing, reducing the need for additional I/O expanders in many designs.
  • Embedded Memory On-Chip: Approximately 0.108 Mbits of RAM supports localized data buffering and short-term storage without external memory.
  • Compact BGA Packaging: The 484-FPBGA (23×23) package balances pin count and board area for space-constrained layouts while supporting surface-mount assembly.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, appropriate for typical commercial-grade applications and environments.
  • Clear Power Specification: A defined 1.14 V supply simplifies power-supply design and integration into multi-voltage systems.

Why Choose M1A3P600L-FG484?

The M1A3P600L-FG484 positions itself as a commercially graded, mid-density ProASIC3L FPGA suitable for designs that need a balance of logic capacity, on-chip memory and a high I/O count within a compact BGA package. Its specified 13,824 logic elements, ~0.108 Mbits of embedded RAM, 235 I/Os and 600,000-gate equivalence make it a solid option for systems requiring moderate programmable logic integration.

Manufactured by Microchip Technology and supplied in a 484-FPBGA (23×23) surface-mount package, this device is aimed at developers and procurement teams building commercial products where predictable electrical and thermal parameters (1.14 V supply, 0 °C to 85 °C) are required.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3P600L-FG484 ProASIC3L FPGA.

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