M1A3P600L-FG484I

The M1A3P600L-FG484I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, provided in a 484-ball BGA package for surface-mount assembly. It combines 13,824 logic elements and approximately 110,592 bits of on-chip RAM with 235 I/O to support mid-density programmable logic designs in industrial environments.

With a core gate count of 600,000 and a low-voltage supply range of 1.14 V to 1.575 V, this device is suited to applications that require a balance of logic capacity, embedded memory, and robust operating temperature range.

Key Features

• Core Logic 13,824 logic elements (cells) supporting up to 600,000 gates of user logic for implementing complex digital functions.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering, small FIFOs, and state storage.
• I/O Capacity 235 I/O pins to interface with peripherals, sensors, and higher-level systems.
• Power Operates from a 1.14 V to 1.575 V supply range to match low-voltage system domains.
• Package & Mounting 484-ball fine-pitch BGA—supplier package 484-FPBGA (23×23)—designed for surface-mount assembly in space-efficient designs.
• Industrial Temperature Grade Specified for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• Industrial Control and Automation — Use the device for sensor interfacing, protocol bridging, and custom control logic where industrial temperature range and robust I/O counts are required.
• Data Acquisition — Implement front-end data preprocessing, small-buffer storage, and deterministic logic for measurement systems leveraging on-chip RAM and plentiful logic elements.
• Communications and Interface Bridging — Deploy as a flexible protocol adapter or timing controller where 235 I/O and programmable logic density enable custom interface implementations.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and 600,000 gates provide clear capacity for mid-range programmable designs without overprovisioning.
• Embedded Memory for On-chip Buffers: Approximately 0.11 Mbits of RAM supports local buffering and small FIFO implementations, reducing external memory needs.
• High I/O Count: 235 I/O pins simplify board-level integration by enabling direct connections to multiple peripherals and sensors.
• Industrial-Grade Operating Range: −40 °C to 100 °C rating supports deployment in factory and process environments.
• Compact BGA Package: 484-BGA (484-FPBGA, 23×23) delivers a high pin count in a compact footprint for dense board layouts.
• Low-Voltage Operation: 1.14 V to 1.575 V supply compatibility fits modern low-voltage system architectures.

Why Choose M1A3P600L-FG484I?

The M1A3P600L-FG484I positions itself as a practical mid-density FPGA choice for engineers who need reliable logic capacity, embedded memory, and comprehensive I/O in an industrial-grade device. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and a 235-pin I/O matrix makes it suitable for control, interface, and data-preprocessing roles where predictable operating temperature and low-voltage operation matter.

Backed by Microchip Technology, the part offers a clear specification set for design planning and long-term deployment. It is well suited to teams seeking a field-programmable solution that balances integration, thermal tolerance, and board-level density.

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