M1A3P600L-FG144

IC FPGA 177 I/O 144FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 177 110592 144-LBGA

Quantity 847 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O177Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600L-FG144 – ProASIC3L Field Programmable Gate Array (FPGA) IC 177 110592 144-LBGA

The M1A3P600L-FG144 is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology. It provides mid-range programmable logic capacity with 13,824 logic elements and approximately 110,592 bits of on-chip RAM, delivering a balance of logic density and embedded memory for configurable digital designs.

With up to 177 user I/O pins, a logic capacity of roughly 600,000 gates, a 144-LBGA surface-mount package, and a supply voltage range of 1.14 V to 1.575 V, this device targets applications that require moderate integration in a compact board footprint while meeting commercial temperature and RoHS compliance requirements.

Key Features

  • Core Logic  13,824 logic elements providing roughly 600,000 equivalent gates for implementing combinational and sequential logic functions.
  • Embedded Memory  Approximately 110,592 bits of on-chip RAM for buffering, FIFOs, and small memory structures within the FPGA fabric.
  • I/O Density  Up to 177 user I/O pins to interface with multiple peripherals and external devices.
  • Power  Operates from a supply voltage range of 1.14 V to 1.575 V to match system power rails within that range.
  • Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

  • Embedded control and glue logic  Use the device's 13,824 logic elements and 177 I/Os to implement custom control, interfacing, and glue logic between digital subsystems.
  • Protocol bridging and interface adaptation  The combination of logic density and I/O count supports protocol conversion and signal adaptation tasks on compact PCBs.
  • Prototyping and development  Provides a mid-range fabric and on-chip RAM for validating designs that require up to ~600,000 gates before transfer to final silicon.
  • Peripheral aggregation  High I/O availability enables aggregation and management of multiple peripheral signals in a single programmable device.

Unique Advantages

  • Balanced logic and memory mix: The device pairs 13,824 logic elements with approximately 110,592 bits of embedded RAM to support a variety of mid-range digital functions.
  • High I/O count: 177 user I/O pins allow direct connection to numerous peripherals and external interfaces without immediate need for additional I/O expanders.
  • Compact LBGA package: 144-LBGA (13×13 FPBGA) surface-mount package delivers a small board footprint for space-constrained designs.
  • Defined commercial operating range: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronics environments.
  • Controlled supply range: Supports system designs using supply voltages between 1.14 V and 1.575 V for clear power integration planning.
  • RoHS compliant: Meets RoHS requirements for lead-free assembly and environmental regulatory alignment.

Why Choose M1A3P600L-FG144?

The M1A3P600L-FG144 positions itself as a mid-range ProASIC3L FPGA option for designers who need a practical combination of logic capacity, embedded memory, and I/O density in a compact surface-mount package. Its 13,824 logic elements and approximately 110,592 bits of RAM make it suitable for designs that require substantial programmable logic without moving to larger, higher-density devices.

Backed by Microchip Technology and provided in a 144-LBGA package with commercial temperature grading and RoHS compliance, this FPGA is a viable choice for teams seeking a scalable, verifiable programmable logic component for commercial electronic products.

Request a quote or submit an inquiry to obtain pricing and availability for the M1A3P600L-FG144. Include your quantity and required delivery timeframe to receive a tailored response.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up