M1A3P600L-1FGG484I

The M1A3P600L-1FGG484I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, supplied in a 484-BGA package. With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 I/O pins, it is designed for applications that require significant on-chip logic density combined with a compact BGA footprint.

Operating over a voltage range of 1.14 V to 1.575 V and an industrial temperature range of −40 °C to 100 °C, this device targets designs needing reliable operation across extended environmental conditions.

Key Features

• Core Logic 13,824 logic elements (cells) providing a programmable fabric suitable for moderate to complex logic integration; reported equivalent of 600,000 gates for design capacity.
• Embedded Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) to support internal buffering, state storage and local data processing.
• I/O Density 235 available I/O pins to support a wide range of external interfaces and parallel connectivity requirements.
• Power and Supply Core supply range from 1.14 V to 1.575 V, allowing designs that align to low-voltage FPGA power domains.
• Package and Mounting 484-ball fine-pitch BGA (484-FPBGA, 23×23) in a surface-mount package for compact board integration and high pin-count routing.
• Temperature and Grade Industrial-grade device specified for operation from −40 °C to 100 °C, suitable for extended-temperature applications.
• Regulatory Status RoHS compliant, supporting designs with lead-free material requirements.

Typical Applications

• Industrial control systems — Use the M1A3P600L-1FGG484I where industrial-temperature operation and a moderate logic count enable custom control, sequencing and interface functions.
• Embedded processing and glue logic — Deploy the FPGA to consolidate multiple discrete devices into programmable logic using its 13,824 logic elements and 235 I/Os.
• Custom interface bridging — Leverage high I/O density and on-chip RAM for protocol conversion, parallel-to-serial bridging and interface aggregation.

Unique Advantages

• Significant logic capacity: 13,824 logic elements and an equivalent of 600,000 gates enable integration of moderate-complexity digital functions into a single device, reducing system BOM.
• On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports local data storage and low-latency data paths without external memory.
• High I/O count: 235 I/Os provide flexibility to connect multiple peripherals, sensors and buses directly to the FPGA fabric.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in environments with wide temperature variation.
• Compact BGA footprint: 484-FPBGA (23×23) surface-mount package balances high pin count with space-efficient board layout.
• RoHS compliant: Simplifies compliance with lead-free assembly and environmental material requirements.

Why Choose M1A3P600L-1FGG484I?

The M1A3P600L-1FGG484I positions itself as a reliable, industrial-grade FPGA option that combines a substantial logic element count, meaningful on-chip RAM, and a high I/O density in a compact 484-BGA package. Its voltage range and temperature rating make it suitable for designs that require stable operation across varied environments while consolidating discrete logic into a programmable fabric.

This device is well suited for engineers and procurement teams building industrial control, embedded processing or custom interface solutions who need predictable thermal and electrical specifications along with manufacturer-backed support from Microchip Technology.

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