M1A3P600L-1FGG484

The M1A3P600L-1FGG484 is a ProASIC3L field programmable gate array delivered in a 484-ball fine-pitch BGA package. It provides a fixed-function FPGA fabric designed for integration into commercial electronic designs where configurable logic, on-chip memory and flexible I/O are required.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 235 user I/O pins and a 600,000-gate equivalent capacity, this device targets mid-density digital designs that require a balance of integration and a compact surface-mount package. It operates over a 1.14 V to 1.575 V supply range and is specified for commercial temperature use (0 °C to 85 °C).

Key Features

• Logic Capacity 13,824 logic elements provide the programmable resources for implementing combinational and sequential digital logic designs.
• On-Chip Memory Approximately 0.11 Mbits of embedded RAM supports data buffering, LUT storage and small on-chip memory needs.
• I/O Count 235 available I/O pins enable connections to multiple peripherals, interfaces and board-level signals.
• Gate Equivalent 600,000-gate equivalent capacity for mapping moderate-complexity designs into the FPGA fabric.
• Package & Mounting 484-FPBGA (23×23) package in a surface-mount form factor for compact board integration.
• Power Supply Operates from 1.14 V to 1.575 V, supporting low-voltage system designs.
• Temperature & Grade Commercial grade device specified for 0 °C to 85 °C operation.
• RoHS Compliant Manufactured to meet RoHS requirements for reduced hazardous substances.

Typical Applications

• Custom digital logic and prototyping Implement glue logic, state machines and custom accelerators using the device’s 13,824 logic elements and on-chip memory.
• I/O-heavy control systems Utilize the 235 user I/O pins to interface with sensors, peripherals and external buses in board-level designs.
• Embedded systems requiring compact packaging The 484-BGA surface-mount package supports space-constrained PCBs while providing substantial logic and memory resources.

Unique Advantages

• Balanced logic and memory mix 13,824 logic elements combined with approximately 0.11 Mbits of embedded RAM give designers flexibility to implement both control logic and local data buffering on-chip.
• High I/O count for flexible interfacing 235 I/O pins simplify integration with multiple peripherals without requiring large external glue logic.
• Compact BGA footprint 484-FPBGA (23×23) package enables dense board layouts while maintaining accessible FPGA resources.
• Low-voltage operation Support for 1.14 V to 1.575 V supply rails aligns with modern low-voltage system architectures.
• RoHS-compliant commercial-grade component Meets environmental compliance expectations for commercial electronic products operating from 0 °C to 85 °C.

Why Choose M1A3P600L-1FGG484?

The M1A3P600L-1FGG484 positions itself as a mid-density, commercial-grade FPGA option that combines a sizable logic element count, embedded RAM and a high I/O count in a compact 484-BGA surface-mount package. Its voltage range and temperature specification make it suitable for a wide range of commercial electronic designs that need on-chip programmability without sacrificing board space.

Designers and procurement teams seeking a RoHS-compliant, configurable device with clear on-chip resources—13,824 logic elements, ~0.11 Mbits of RAM, 235 I/O and a 600,000-gate equivalent—will find this part appropriate for applications requiring moderate integration and flexible interfacing.

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