M1A3P600L-FGG144

The M1A3P600L-FGG144 is a commercial-grade ProASIC3L field programmable gate array (FPGA) in a 144-LBGA package. It provides a programmable fabric with 13,824 logic elements and approximately 0.11 Mbits of embedded memory for custom digital logic implementation.

Designed for surface-mount assembly, this device supports up to 177 I/O pins and a core supply range of 1.14 V to 1.575 V, making it suitable for a range of commercial embedded logic applications that require moderate logic density and on-chip memory.

Key Features

• Core Logic  13,824 logic elements (cells) and approximately 600,000 gates provide a programmable fabric for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffers, FIFOs, and local data storage within the FPGA fabric.
• I/O and Packaging  Up to 177 I/O pins in a 144-LBGA package (supplier device package: 144-FPBGA, 13×13) for compact board-level integration and flexible connectivity options.
• Power  Core supply voltage range from 1.14 V to 1.575 V to match compatible power architectures and regulators.
• Mounting and Temperature  Surface-mount package certified for commercial operating temperatures from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free assembly and adherence to common environmental requirements.

Typical Applications

• Custom Digital Logic  Implement application-specific state machines, glue logic, and data-path processing using the device’s 13,824 logic elements and embedded RAM.
• I/O Interface Control  Drive board-level interface and protocol logic where up to 177 I/O pins are required for sensors, peripherals, or memory interfaces.
• Embedded System Prototyping  Evaluate and validate commercial embedded designs that need reconfigurable logic and on-chip memory within a compact LBGA footprint.

Unique Advantages

• Ample Logic Capacity: 13,824 logic elements enable implementation of moderate-complexity digital designs without external gate arrays.
• On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• High I/O Count in a Compact Package: 177 I/Os in a 144-LBGA (144-FPBGA, 13×13) package balances connectivity with a small board footprint.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation to match standard commercial product requirements.
• RoHS Compliance: Meets common environmental restrictions for lead-free manufacturing.
• Surface-Mount Ready: Designed for standard surface-mount PCB assembly processes for efficient manufacturing integration.

Why Choose M1A3P600L-FGG144?

The M1A3P600L-FGG144 positions itself as a commercially graded, compact FPGA solution that delivers a balanced combination of logic capacity, embedded memory, and high I/O density. Its 13,824 logic elements and approximately 0.11 Mbits of on-chip RAM provide the resources needed for a wide range of custom digital and interface tasks without adding external programmable logic.

This device is appropriate for engineering teams developing commercial embedded systems that require reconfigurable logic, dense I/O, and RoHS-compliant, surface-mount integration. Its clear electrical and mechanical specifications support predictable design and procurement decisions for production and prototype runs.

Request a quote or submit an inquiry to start a procurement or evaluation request for the M1A3P600L-FGG144.