M1A3P600L-FGG484
| Part Description |
ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA |
|---|---|
| Quantity | 393 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 235 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of M1A3P600L-FGG484 – ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA
The M1A3P600L-FGG484 is a ProASIC3L FPGA from Microchip Technology packaged in a 484-ball BGA. It provides a mid-range programmable logic solution with a defined set of logic resources, memory, and I/O suitable for commercial-grade electronic designs.
Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 bits), 600,000 gates and 235 user I/O. The device ships in a 484-FPBGA (23×23) surface-mount package and operates on a low-voltage supply from 1.14 V to 1.575 V at commercial temperatures (0 °C to 85 °C).
Key Features
- Core Logic 13,824 logic elements and a 600,000-gate equivalent fabric provide deterministic, programmable logic capacity for glue logic and custom datapaths.
- Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for buffering, state storage and small lookup tables.
- I/O Density 235 user I/O pins support multiple peripheral interfaces and parallel connections directly from the FPGA fabric.
- Package & Mounting 484-ball FPBGA (23×23) package in a surface-mount form factor for compact board integration and high pin-count routing.
- Power Operates from a low-voltage supply range of 1.14 V to 1.575 V to match low-voltage system rails.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer applications.
- Regulatory RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Custom logic integration Implement glue logic, protocol conversion and application-specific processing where 13,824 logic elements and on-chip RAM meet functional needs.
- I/O-intensive systems Support multiple peripherals and parallel interfaces using the device’s 235 user I/O pins for system-level integration.
- Embedded control and glue logic Use the FPGA for control sequencing, state machines and interfacing between digital subsystems within commercial electronic products.
Unique Advantages
- Balanced logic capacity: 13,824 logic elements and 600,000 gates give designers a mid-range programmable fabric suitable for a wide range of integration tasks without overprovisioning.
- Compact, high-density package: The 484-FPBGA (23×23) package provides a high pin count in a compact surface-mount footprint for space-constrained boards.
- Substantial I/O count: 235 user I/O pins enable direct interfacing to multiple peripherals and system buses, reducing the need for external I/O expanders.
- On-chip RAM for buffering: Approximately 0.11 Mbits of embedded memory supports small buffers, FIFOs and lookup tables without external memory.
- Low-voltage operation: 1.14 V to 1.575 V supply range aligns with modern low-voltage digital rails.
- RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.
Why Choose M1A3P600L-FGG484?
The M1A3P600L-FGG484 positions itself as a commercial-grade, mid-density FPGA option for designs that need a balance of logic resources, embedded memory and a high I/O count in a compact BGA package. Its specified voltage range and operating temperature make it suitable for standard embedded electronics where on-board programmable logic can consolidate functions and simplify board-level architecture.
Designed and manufactured by Microchip Technology, this ProASIC3L FPGA is appropriate for engineers seeking a programmable device that delivers defined capacity, compact board integration and RoHS compliance for ongoing production needs.
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