M1A3P600L-FGG484

IC FPGA 235 I/O 484FBGA
Part Description

ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

Quantity 393 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O235Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of M1A3P600L-FGG484 – ProASIC3L Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA

The M1A3P600L-FGG484 is a ProASIC3L FPGA from Microchip Technology packaged in a 484-ball BGA. It provides a mid-range programmable logic solution with a defined set of logic resources, memory, and I/O suitable for commercial-grade electronic designs.

Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 bits), 600,000 gates and 235 user I/O. The device ships in a 484-FPBGA (23×23) surface-mount package and operates on a low-voltage supply from 1.14 V to 1.575 V at commercial temperatures (0 °C to 85 °C).

Key Features

  • Core Logic  13,824 logic elements and a 600,000-gate equivalent fabric provide deterministic, programmable logic capacity for glue logic and custom datapaths.
  • Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for buffering, state storage and small lookup tables.
  • I/O Density  235 user I/O pins support multiple peripheral interfaces and parallel connections directly from the FPGA fabric.
  • Package & Mounting  484-ball FPBGA (23×23) package in a surface-mount form factor for compact board integration and high pin-count routing.
  • Power  Operates from a low-voltage supply range of 1.14 V to 1.575 V to match low-voltage system rails.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer applications.
  • Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Custom logic integration  Implement glue logic, protocol conversion and application-specific processing where 13,824 logic elements and on-chip RAM meet functional needs.
  • I/O-intensive systems  Support multiple peripherals and parallel interfaces using the device’s 235 user I/O pins for system-level integration.
  • Embedded control and glue logic  Use the FPGA for control sequencing, state machines and interfacing between digital subsystems within commercial electronic products.

Unique Advantages

  • Balanced logic capacity: 13,824 logic elements and 600,000 gates give designers a mid-range programmable fabric suitable for a wide range of integration tasks without overprovisioning.
  • Compact, high-density package: The 484-FPBGA (23×23) package provides a high pin count in a compact surface-mount footprint for space-constrained boards.
  • Substantial I/O count: 235 user I/O pins enable direct interfacing to multiple peripherals and system buses, reducing the need for external I/O expanders.
  • On-chip RAM for buffering: Approximately 0.11 Mbits of embedded memory supports small buffers, FIFOs and lookup tables without external memory.
  • Low-voltage operation: 1.14 V to 1.575 V supply range aligns with modern low-voltage digital rails.
  • RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose M1A3P600L-FGG484?

The M1A3P600L-FGG484 positions itself as a commercial-grade, mid-density FPGA option for designs that need a balance of logic resources, embedded memory and a high I/O count in a compact BGA package. Its specified voltage range and operating temperature make it suitable for standard embedded electronics where on-board programmable logic can consolidate functions and simplify board-level architecture.

Designed and manufactured by Microchip Technology, this ProASIC3L FPGA is appropriate for engineers seeking a programmable device that delivers defined capacity, compact board integration and RoHS compliance for ongoing production needs.

Request a quote or submit a pricing request to receive availability and lead-time information for the M1A3P600L-FGG484.

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