M1A3PE1500-1FG484I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 280 276480 484-BGA |
|---|---|
| Quantity | 591 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 280 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-1FG484I – ProASIC3E FPGA, 484-BGA
The M1A3PE1500-1FG484I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology supplied in a 484-ball BGA package. It provides a medium-density fabric with 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 1,500,000 gates to implement custom digital logic.
With 280 I/O pins, a 484-FPBGA (23×23) package outline, industrial-grade operating range and RoHS compliance, this device is intended for applications that require a balance of logic capacity, on-chip memory and high I/O connectivity in a compact surface-mount BGA footprint.
Key Features
- Logic Capacity — 38,400 logic elements (logic cells) providing the core programmable resources for custom logic implementations.
- Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) for data buffering, FIFOs or small working memory.
- I/O Count — 280 available I/Os to support parallel interfaces, bus bridging or multiple peripheral connections.
- Gate Equivalent — 1,500,000 gates of integration for mid-range system logic and glue-logic consolidation.
- Package — 484-BGA in a 484-FPBGA (23×23) supplier device package, surface-mount mounting type for PCB space-efficient designs.
- Power — Single core supply range of 1.425 V to 1.575 V to match system power rails and enable stable operation within the specified window.
- Industrial Temperature Range — Rated to operate from −40 °C to 100 °C, suitable for industrial-environment deployments.
- Regulatory — RoHS compliant.
Typical Applications
- Industrial Control and Automation — Industrial-grade temperature range and high I/O count allow implementation of sensor interfacing, protocol bridging and control logic in factory or process environments.
- Communications and Networking — Logic capacity and ample I/Os support protocol handling, interface translation and packet processing functions in communications equipment.
- Data Acquisition and Instrumentation — On-chip memory and extensive I/O enable buffering, aggregation and preprocessing of measurement data in test and measurement systems.
Unique Advantages
- Balanced Logic and Memory — 38,400 logic elements combined with approximately 0.276 Mbits of RAM supports a wide range of mid-density logic designs without excessive external components.
- High Pin Count — 280 I/Os reduce the need for external multiplexers and simplify board-level interface routing for multi-sensor or multi-peripheral systems.
- Compact BGA Footprint — 484-FPBGA (23×23) package provides a space-efficient surface-mount solution for densely populated PCBs.
- Industrial Reliability — Rated operation from −40 °C to 100 °C and RoHS compliance align with industrial deployment requirements.
- Clear Power Envelope — Defined supply range (1.425 V to 1.575 V) helps streamline power-supply design and integration.
Why Choose M1A3PE1500-1FG484I?
The M1A3PE1500-1FG484I positions itself as a mid-density ProASIC3E FPGA solution that combines a substantial logic element count with embedded RAM and a high I/O complement in a compact 484-BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for designs where robustness and regulatory adherence matter.
Engineers and procurement teams looking to consolidate discrete logic, implement custom interfaces or add programmable functionality while keeping board space and component count in check will find this device aligned with those objectives. The combination of logic resources, on-chip memory and abundant I/Os provides a scalable building block for a range of embedded and industrial systems.
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