M1A3PE1500-1FG676I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA |
|---|---|
| Quantity | 268 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 444 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-1FG676I – ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA
The M1A3PE1500-1FG676I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology designed for industrial applications that require a balance of logic capacity, on-chip memory and high I/O density. Its architecture provides a sizable pool of programmable logic and embedded memory to implement mid-range digital systems and interface-rich designs.
This device is specified for surface-mount deployment in a 676-ball BGA (27 × 27) package and supports industrial temperature operation, making it suitable for a range of embedded control, communications and instrumentation applications that demand robust environmental performance and high pin count connectivity.
Key Features
- Logic Capacity Approximately 38,400 logic elements (38400 logic elements) and 1,500,000 gates provide substantial programmable logic resources for glue logic, state machines and custom datapaths.
- Embedded Memory Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) to support buffering, FIFOs and small on-chip data storage needs.
- High I/O Count 444 user I/O pins enable dense external connectivity for sensor arrays, parallel interfaces and multi-channel I/O systems.
- Package and Mounting 676-ball FBGA package (27 × 27) in a surface-mount form factor provides a compact, high-density footprint for space-constrained boards.
- Power Delivered for operation within a supply range of 1.425 V to 1.575 V, enabling integration into designs with defined low-voltage rails.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments and systems with extended temperature requirements.
- Compliance RoHS-compliant construction supports regulatory requirements for lead-free assemblies.
Typical Applications
- Industrial Control Implement machine control logic, PLC interfaces and real-time coordination tasks leveraging the device's industrial temperature rating and logic capacity.
- High-Density I/O Systems Interface boards and equipment requiring many external connections benefit from 444 user I/O pins for parallel sensors, I/O expansion and multi-channel I/O aggregation.
- Communications and Networking Use the FPGA for protocol bridging, packet handling and custom interfacing where on-chip logic and embedded memory provide deterministic processing.
- Test & Measurement Create custom acquisition front ends, timing controllers and data aggregation functions taking advantage of the device's logic and memory resources.
Unique Advantages
- Substantial Logic Resource: With approximately 38,400 logic elements and 1.5 million gates, the device supports complex control and processing tasks without external logic.
- Embedded Memory for Local Data: Approximately 0.276 Mbits of on-chip RAM reduces dependence on external memory for buffering and temporary storage.
- Very High I/O Count: 444 I/Os enable direct connection to many peripherals and sensors, minimizing external multiplexing and I/O expanders.
- Compact, High-Density Package: The 676-FBGA (27 × 27) package provides a dense footprint for designs that require many signals in a compact area.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied by Microchip Technology, the device is suited for demanding environments and long-life industrial applications.
- Regulatory Compliance: RoHS compliance supports lead-free assembly processes and environmental requirements.
Why Choose M1A3PE1500-1FG676I?
The M1A3PE1500-1FG676I positions itself as a robust mid-range FPGA solution for engineers who need a balanced mix of programmable logic, embedded memory and an extensive I/O complement in a compact surface-mount package. Its industrial temperature rating and RoHS-compliant construction make it appropriate for long-life embedded systems deployed in challenging environments.
Designed for applications that require high I/O density and substantial on-chip resources, this device is a practical choice for system designers focused on integration, deterministic hardware logic and reliable operation under industrial conditions. Backed by Microchip Technology, it provides a clear specification set for procurement and system integration.
Request a quote for M1A3PE1500-1FG676I today to evaluate it for your next design or to obtain pricing and availability information.

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