M1A3PE1500-1FG676I

IC FPGA 444 I/O 676FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA

Quantity 268 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O444Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1A3PE1500-1FG676I – ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA

The M1A3PE1500-1FG676I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology designed for industrial applications that require a balance of logic capacity, on-chip memory and high I/O density. Its architecture provides a sizable pool of programmable logic and embedded memory to implement mid-range digital systems and interface-rich designs.

This device is specified for surface-mount deployment in a 676-ball BGA (27 × 27) package and supports industrial temperature operation, making it suitable for a range of embedded control, communications and instrumentation applications that demand robust environmental performance and high pin count connectivity.

Key Features

  • Logic Capacity  Approximately 38,400 logic elements (38400 logic elements) and 1,500,000 gates provide substantial programmable logic resources for glue logic, state machines and custom datapaths.
  • Embedded Memory  Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) to support buffering, FIFOs and small on-chip data storage needs.
  • High I/O Count  444 user I/O pins enable dense external connectivity for sensor arrays, parallel interfaces and multi-channel I/O systems.
  • Package and Mounting  676-ball FBGA package (27 × 27) in a surface-mount form factor provides a compact, high-density footprint for space-constrained boards.
  • Power  Delivered for operation within a supply range of 1.425 V to 1.575 V, enabling integration into designs with defined low-voltage rails.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and systems with extended temperature requirements.
  • Compliance  RoHS-compliant construction supports regulatory requirements for lead-free assemblies.

Typical Applications

  • Industrial Control  Implement machine control logic, PLC interfaces and real-time coordination tasks leveraging the device's industrial temperature rating and logic capacity.
  • High-Density I/O Systems  Interface boards and equipment requiring many external connections benefit from 444 user I/O pins for parallel sensors, I/O expansion and multi-channel I/O aggregation.
  • Communications and Networking  Use the FPGA for protocol bridging, packet handling and custom interfacing where on-chip logic and embedded memory provide deterministic processing.
  • Test & Measurement  Create custom acquisition front ends, timing controllers and data aggregation functions taking advantage of the device's logic and memory resources.

Unique Advantages

  • Substantial Logic Resource: With approximately 38,400 logic elements and 1.5 million gates, the device supports complex control and processing tasks without external logic.
  • Embedded Memory for Local Data: Approximately 0.276 Mbits of on-chip RAM reduces dependence on external memory for buffering and temporary storage.
  • Very High I/O Count: 444 I/Os enable direct connection to many peripherals and sensors, minimizing external multiplexing and I/O expanders.
  • Compact, High-Density Package: The 676-FBGA (27 × 27) package provides a dense footprint for designs that require many signals in a compact area.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied by Microchip Technology, the device is suited for demanding environments and long-life industrial applications.
  • Regulatory Compliance: RoHS compliance supports lead-free assembly processes and environmental requirements.

Why Choose M1A3PE1500-1FG676I?

The M1A3PE1500-1FG676I positions itself as a robust mid-range FPGA solution for engineers who need a balanced mix of programmable logic, embedded memory and an extensive I/O complement in a compact surface-mount package. Its industrial temperature rating and RoHS-compliant construction make it appropriate for long-life embedded systems deployed in challenging environments.

Designed for applications that require high I/O density and substantial on-chip resources, this device is a practical choice for system designers focused on integration, deterministic hardware logic and reliable operation under industrial conditions. Backed by Microchip Technology, it provides a clear specification set for procurement and system integration.

Request a quote for M1A3PE1500-1FG676I today to evaluate it for your next design or to obtain pricing and availability information.

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