M1A3PE1500-1FGG484I

The M1A3PE1500-1FGG484I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a combination of logic density, on-chip RAM and I/O count in a compact 484‑BGA package for higher-density programmable logic implementations.

Key device parameters include 38,400 logic elements, approximately 0.276 Mbits of embedded memory (276,480 bits), 1,500,000 gates and 280 I/O pins, with a supply voltage range of 1.425 V to 1.575 V and industrial operating temperature from -40 °C to 100 °C.

Key Features

• Logic Capacity — 38,400 logic elements and 1,500,000 gates provide the raw programmable fabric needed for medium-to-high density logic designs.
• Embedded Memory — Approximately 0.276 Mbits of total on-chip RAM (276,480 bits) supports local buffering, state storage and memory-intensive functions without external memory.
• I/O Density — 280 available I/O pins enable dense peripheral interfacing and multi-channel I/O designs.
• Power Supply — Core supply range of 1.425 V to 1.575 V for stable operation within the specified voltage window.
• Package & Mounting — 484‑BGA (23 × 23) package in a surface-mount form factor for space-efficient PCB layouts.
• Temperature & Grade — Industrial grade device rated for operation from -40 °C to 100 °C to meet thermally demanding environments.
• Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control — Industrial-grade temperature range and a high I/O count make the device suitable for control systems and I/O-intensive automation tasks.
• High-density Logic Implementations — 38,400 logic elements and 1,500,000 gates enable implementation of complex digital functions and glue logic.
• Memory-intensive Functions — Approximately 0.276 Mbits of embedded RAM supports local buffering, state machines and small data path storage without external memory.
• Compact PCB Designs — 484‑BGA surface-mount package allows high-density placement for space-constrained boards.

Unique Advantages

• Significant logic density: 38,400 logic elements and 1,500,000 gates provide ample capacity for complex programmable designs, reducing the need for multiple devices.
• On-chip memory reduces BOM: Approximately 0.276 Mbits of embedded RAM lowers dependence on external memory components for many use cases.
• High I/O count: 280 I/O pins support multi-channel interfacing and flexible peripheral connectivity directly from the FPGA fabric.
• Industrial temperature operation: Rated for -40 °C to 100 °C to support deployments in demanding thermal environments.
• Compact, production-ready package: 484‑BGA surface-mount package enables space-efficient board integration and high-density routing.
• Regulatory readiness: RoHS compliance supports compliance-focused manufacturing processes.

Why Choose M1A3PE1500-1FGG484I?

The M1A3PE1500-1FGG484I positions itself as a high-density, industrial-grade FPGA option with a balanced mix of logic elements, embedded memory and I/O in a compact 484‑BGA package. Its specified core voltage range and operating temperature make it suitable for designs that require sustained operation across a wide thermal range.

This device is appropriate for engineering teams and procurement looking for a programmable, on‑chip solution that consolidates logic, memory and I/O into a single surface-mount package while meeting RoHS requirements.

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