M1A3PE1500-1FG676
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA |
|---|---|
| Quantity | 550 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 444 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-1FG676 – ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA
The M1A3PE1500-1FG676 is a ProASIC3E family FPGA from Microchip Technology, offered in a 676-FBGA (27×27) surface-mount package. It provides a high-density programmable logic resource set targeted at commercial electronic designs.
Key device attributes include 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 444 user I/Os, and a nominal supply voltage range of 1.425 V to 1.575 V. The part is rated for commercial operating temperatures (0 °C to 85 °C) and is RoHS compliant.
Key Features
- Core Architecture ProASIC3E FPGA device-level implementation from Microchip Technology delivering 38,400 logic elements for programmable logic integration.
- Logic Density 1,500,000 gates and 38,400 logic elements to support complex digital functions and integration of multiple logic blocks on-chip.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
- I/O Capability 444 available I/Os to interface with peripherals, sensors, and external logic directly from the FPGA fabric.
- Power Supply Operates from a supply voltage range of 1.425 V to 1.575 V, suitable for regulated core power domains common in FPGA deployments.
- Package and Mounting 676-FBGA (27×27) package in a surface-mount form factor for compact board layouts and high pin density.
- Temperature and Compliance Commercial operating range of 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.
Unique Advantages
- High integration density: 38,400 logic elements and 1,500,000 gates enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
- On-chip memory: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for small buffering and state retention.
- Extensive I/O: 444 user I/Os allow broad connectivity to peripherals and system interfaces, supporting versatile system integration.
- Compact BGA footprint: 676-FBGA (27×27) surface-mount package supports dense PCB routing and space-constrained designs.
- Commercial suitability and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for use in commercial electronic products.
Why Choose M1A3PE1500-1FG676?
The M1A3PE1500-1FG676 positions itself as a commercial-grade ProASIC3E FPGA that combines substantial logic resources, on-chip memory, and a large I/O count in a compact 676-FBGA package. These attributes make it suitable for designers looking to integrate complex programmable logic into space-constrained, commercial-product designs.
With clear electrical and environmental parameters—1.425 V to 1.575 V core supply, 0 °C to 85 °C operating range, and RoHS compliance—this device supports predictable sourcing and long-term deployment where commercial specifications are required.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for M1A3PE1500-1FG676.

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