M1A3PE1500-1FG676

IC FPGA 444 I/O 676FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA

Quantity 550 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O444Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1A3PE1500-1FG676 – ProASIC3E Field Programmable Gate Array (FPGA) IC 444 276480 676-BGA

The M1A3PE1500-1FG676 is a ProASIC3E family FPGA from Microchip Technology, offered in a 676-FBGA (27×27) surface-mount package. It provides a high-density programmable logic resource set targeted at commercial electronic designs.

Key device attributes include 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 444 user I/Os, and a nominal supply voltage range of 1.425 V to 1.575 V. The part is rated for commercial operating temperatures (0 °C to 85 °C) and is RoHS compliant.

Key Features

  • Core Architecture ProASIC3E FPGA device-level implementation from Microchip Technology delivering 38,400 logic elements for programmable logic integration.
  • Logic Density 1,500,000 gates and 38,400 logic elements to support complex digital functions and integration of multiple logic blocks on-chip.
  • Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
  • I/O Capability 444 available I/Os to interface with peripherals, sensors, and external logic directly from the FPGA fabric.
  • Power Supply Operates from a supply voltage range of 1.425 V to 1.575 V, suitable for regulated core power domains common in FPGA deployments.
  • Package and Mounting 676-FBGA (27×27) package in a surface-mount form factor for compact board layouts and high pin density.
  • Temperature and Compliance Commercial operating range of 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.

Unique Advantages

  • High integration density: 38,400 logic elements and 1,500,000 gates enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
  • On-chip memory: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for small buffering and state retention.
  • Extensive I/O: 444 user I/Os allow broad connectivity to peripherals and system interfaces, supporting versatile system integration.
  • Compact BGA footprint: 676-FBGA (27×27) surface-mount package supports dense PCB routing and space-constrained designs.
  • Commercial suitability and compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for use in commercial electronic products.

Why Choose M1A3PE1500-1FG676?

The M1A3PE1500-1FG676 positions itself as a commercial-grade ProASIC3E FPGA that combines substantial logic resources, on-chip memory, and a large I/O count in a compact 676-FBGA package. These attributes make it suitable for designers looking to integrate complex programmable logic into space-constrained, commercial-product designs.

With clear electrical and environmental parameters—1.425 V to 1.575 V core supply, 0 °C to 85 °C operating range, and RoHS compliance—this device supports predictable sourcing and long-term deployment where commercial specifications are required.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for M1A3PE1500-1FG676.

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