M1A3P600L-FGG484I

The M1A3P600L-FGG484I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for industrial and embedded applications. It provides reconfigurable logic resources with 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and support for 235 I/O lines in a compact 484-ball BGA package.

With an operating temperature range of -40 °C to 100 °C and a nominal supply window of 1.14 V to 1.575 V, this surface-mount, RoHS-compliant device targets designs that require robust, reprogrammable logic and moderate on-chip RAM for control, interfacing, and custom digital functions.

Key Features

• Core Logic  13,824 logic elements (equivalent) and approximately 600,000 gates provide programmable digital fabric for custom logic functions and state machines.
• Embedded Memory  Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits, suitable for small buffers, FIFOs, and configuration data.
• Flexible I/O  235 general-purpose I/O pins to support multiple interfaces, board-level connections, and peripheral control.
• Power  Operating supply range from 1.14 V to 1.575 V to match system power domains and design requirements.
• Package and Mounting  484-ball FPBGA (23 × 23) in a 484-BGA package case, optimized for surface-mount assembly on compact PCBs.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS-compliant device to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use the FPGA’s reconfigurable logic and wide temperature rating to implement motor control, PLC interfacing, and real-time control functions.
• Embedded Systems  Leverage the available logic elements and on-chip RAM for custom protocol handling, glue logic, and peripheral management in embedded designs.
• Communication Interfaces  Deploy the device to implement protocol bridging, custom serialization/deserialization, and parallel-to-serial conversions using abundant I/O.
• Sensor and I/O Aggregation  Use the 235 I/O pins for sensor front-ends, data aggregation, and signal conditioning tasks requiring configurable logic.

Unique Advantages

• High Logic Density:  13,824 logic elements and roughly 600,000 gates allow implementation of substantial custom logic within a single device, reducing component count.
• Compact BGA Package:  484-FPBGA (23×23) package enables a small PCB footprint while providing extensive I/O connectivity.
• Industrial-Grade Operation:  Rated from -40 °C to 100 °C to withstand demanding environmental conditions typical of industrial deployments.
• Ample I/O Count:  235 I/O pins support multiple peripheral interfaces and board-level connections without external glue logic.
• Controlled Power Range:  A defined supply window (1.14 V to 1.575 V) aids integration with specific system power rails and low-voltage domains.
• RoHS Compliance:  Meets RoHS requirements for environmental and manufacturing considerations.

Why Choose M1A3P600L-FGG484I?

The M1A3P600L-FGG484I positions itself as a practical, industrial-grade FPGA option for designers needing substantial programmable logic, a high I/O count, and compact packaging. Its combination of 13,824 logic elements, on-chip RAM, and 235 I/Os makes it well suited to embedded and industrial designs that require flexible, reconfigurable digital functions.

Backed by Microchip Technology, this device delivers a balance of integration and environmental robustness that supports scalable designs where reprogrammability and board-level consolidation are priorities. It is a fit for teams aiming to reduce BOM complexity while maintaining a dependable platform for custom digital logic.

Request a quote or submit a pricing inquiry to discuss availability, lead times, and volume pricing for the M1A3P600L-FGG484I.