M1A3PE1500-1FG484

IC FPGA 280 I/O 484FBGA
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 280 276480 484-BGA

Quantity 570 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O280Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1A3PE1500-1FG484 – ProASIC3E Field Programmable Gate Array (FPGA) IC 484-BGA

The M1A3PE1500-1FG484 is a ProASIC3E family Field Programmable Gate Array from Microchip Technology. It provides a mid-density, flash-based FPGA fabric with a balance of logic capacity, on-chip memory and I/O resources for embedded digital designs.

With 38,400 logic elements, approximately 0.28 Mbits of embedded RAM and 280 I/O pins in a compact 484-ball BGA package, this device targets designs that require substantial I/O, moderate logic density and controlled power domains within a commercial temperature range.

Key Features

  • Logic Capacity — 38,400 logic elements (CLBs) providing up to 1,500,000 gate equivalents for implementing custom digital functions and glue logic.
  • Embedded Memory — 276,480 bits of on-chip RAM (approximately 0.28 Mbits) to support buffering, small data stores and state machine implementations.
  • I/O Resources — 280 user I/O pins to support dense peripheral interfaces, sensor arrays and multi-channel signal routing.
  • Package & Mounting — 484-ball FPBGA (23 × 23 mm) footprint in a surface-mount package for compact board-level integration.
  • Power — Core supply voltage range of 1.425 V to 1.575 V to match targeted system power rails and domain requirements.
  • Operating Range & Grade — Commercial temperature grade rated from 0 °C to 85 °C; suitable for standard commercial applications.
  • Environmental Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • I/O-Intensive Interfaces — Ideal for designs that require a large number of parallel or multi-protocol I/O connections, such as interface hubs and protocol bridging.
  • Custom Digital Logic — Suited for implementing custom controllers, glue logic and finite state machines where moderate logic density and on-chip RAM are required.
  • Embedded System Integration — Useful in systems that need compact FPGA integration in a BGA package for board-level space savings while retaining significant I/O.
  • Data Buffering and Small Memory Tasks — On-chip RAM supports buffering, temporary storage and small lookup tables within embedded designs.

Unique Advantages

  • Balanced Logic and Memory: 38,400 logic elements combined with ~0.28 Mbits of embedded RAM give designers a practical mix for a wide range of mid-density functions.
  • Extensive I/O Count: 280 I/O pins enable integration with multiple peripherals and interfaces without external I/O expanders.
  • Compact BGA Packaging: 484-ball FPBGA (23 × 23 mm) allows high pin-count integration in a compact surface-mount form factor for space-constrained PCBs.
  • Defined Power Envelope: A narrow core voltage range (1.425 V–1.575 V) helps simplify power-supply planning and domain control.
  • Commercial Grade & RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant, suitable for mainstream commercial products and manufacturing flows.
  • Backed by Microchip Technology: Manufacturer support and ecosystem continuity for integration into longer-term projects.

Why Choose M1A3PE1500-1FG484?

The M1A3PE1500-1FG484 positions itself as a practical mid-density FPGA choice for designs that require considerable I/O, a solid complement of logic elements and modest embedded memory in a compact BGA package. Its commercial-grade temperature range, defined core voltage and RoHS compliance make it appropriate for mainstream embedded applications where board space and integration matter.

This device is well suited to engineers and teams building interface-rich modules, custom controllers or compact embedded systems that benefit from on-chip logic and RAM backed by Microchip Technology’s supply chain and lifecycle support.

Request a quote or submit your inquiry to receive pricing and availability information for the M1A3PE1500-1FG484. Our team can provide lead-time details and assist with volume or prototype orders.

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