M1A3PE1500-1FGG484

The M1A3PE1500-1FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a balance of logic capacity, on-chip memory, and I/O resources in a compact surface-mount ball grid array package.

Key on-chip resources include approximately 38,400 logic elements (cells), approximately 276,480 bits of embedded RAM, and up to 280 I/O pins — all delivered in a 484-BGA (484-FPBGA, 23×23) package with a 1.425 V to 1.575 V core supply and a commercial operating range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 1,500,000 gates and 38,400 logic elements (cells) for implementing complex digital functions and state machines.
• Embedded Memory  Approximately 276,480 bits (≈0.276 Mbits) of on-chip RAM for small data buffers, FIFOs, and register storage.
• I/O Capacity  Up to 280 I/O pins to support multiple external interfaces and parallel connectivity.
• Power  Core supply range of 1.425 V to 1.575 V to match system power domains and design requirements.
• Package & Mounting  484-BGA supplier device package (484-FPBGA, 23×23) with surface-mount mounting for space-efficient board integration.
• Temperature & Grade  Commercial grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom logic and glue logic  Use the device's ~38,400 logic elements and 280 I/Os to implement bespoke digital functions and interface translation between subsystems.
• I/O-intensive systems  Up to 280 available I/Os make the device suitable for designs requiring extensive parallel connections or multiple peripheral interfaces.
• Buffering and small-data storage  Approximately 276,480 bits of embedded RAM provide on-chip storage for FIFOs, small buffers, and state data without external memory.
• Compact board designs  The 484-BGA (23×23) surface-mount package supports high density PCB layouts where board space is constrained.

Unique Advantages

• High logic capacity: 38,400 logic elements and 1.5M gates enable implementation of substantial digital functionality in a single device.
• Significant I/O resources: 280 I/Os allow direct interfacing to multiple peripherals and parallel data paths without extensive external glue logic.
• On-chip RAM: Approximately 276,480 bits of embedded memory reduce dependence on external memory for small buffering and control structures.
• Compact BGA package: 484-FPBGA (23×23) provides a space-efficient footprint for high-density PCB designs.
• Low-voltage core: Narrow core supply range (1.425 V–1.575 V) supports integration into low-voltage system architectures.
• Commercial temperature rating and RoHS compliance: Specified 0 °C–85 °C operation and RoHS compliance for standard commercial applications.

Why Choose M1A3PE1500-1FGG484?

The M1A3PE1500-1FGG484 positions itself as a capable, commercial-grade FPGA option when you need substantial logic density, on-chip memory, and a high I/O count in a compact BGA package. Its combination of ~38,400 logic elements, ~276,480 bits of embedded RAM, and 280 I/Os makes it suitable for designs that require integrated digital functionality and significant interfacing capability.

For designers targeting space-constrained, commercial-temperature applications with a 1.425 V–1.575 V core domain, this Microchip Technology ProASIC3E device offers a clear set of verifiable specifications to support system-level integration and deployment.

Request a quote or submit an inquiry for pricing and availability of the M1A3PE1500-1FGG484.