M1A3PE1500-1FGG676

The M1A3PE1500-1FGG676 from Microchip Technology is a ProASIC3E field programmable gate array (FPGA) supplied in a 676-ball FBGA (27×27) surface-mount package. It provides 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 1,500,000 gates and 444 I/O pins, making it suitable for commercial embedded designs that require mid-range logic density and extensive I/O.

With a single supply voltage range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C, this device fits applications where on-chip logic resources, I/O count and compact BGA packaging are primary design drivers.

Key Features

• Core Logic — 38,400 logic elements (CLBs) and 1,500,000 gates provide programmable fabric for custom digital logic implementation.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM for local buffering, FIFOs and state storage within the FPGA.
• I/O Capacity — 444 user I/O pins to support wide parallel interfaces, extensive sensor or peripheral connectivity and complex I/O routing.
• Package & Mounting — 676-FBGA (27×27) surface-mount package for high-density board integration and compact system layouts.
• Power — Core voltage supply range of 1.425 V to 1.575 V for defined power domain planning.
• Operating Conditions & Grade — Commercial-grade device with an operating temperature range from 0 °C to 85 °C.
• RoHS Compliance — Device is RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Use as the programmable logic core in commercial electronics that require moderate logic density and a high number of I/O signals.
• Custom I/O Interfaces — High I/O count supports parallel interface bridging, protocol translation, and multi-channel signal routing in compact layouts.
• On-Board Data Buffering — Approximately 0.276 Mbits of embedded memory provides local buffering for data aggregation, short-term storage and flow control.
• Prototype and Product Integration — Surface-mount 676-FBGA package and 38,400 logic elements allow designers to consolidate discrete logic into a single programmable device for both prototyping and production builds.

Unique Advantages

• Balanced Logic and Memory: 38,400 logic elements combined with on-chip RAM supports diverse logic functions while minimizing external memory needs.
• High I/O Density: 444 I/O pins enable broad peripheral connectivity and simplify board-level routing for systems with many external interfaces.
• Compact BGA Packaging: 676-FBGA (27×27) reduces PCB footprint and supports dense board designs where space is constrained.
• Predictable Power Domain: Defined supply voltage range (1.425 V–1.575 V) helps streamline power-supply design and component selection.
• Commercial Grade: Specified 0 °C to 85 °C operating range and RoHS compliance align the device with commercial production requirements.

Why Choose M1A3PE1500-1FGG676?

The M1A3PE1500-1FGG676 positions itself as a practical, commercially graded FPGA for designs that need a mid-level logic resource, substantial I/O capability and integrated on-chip memory in a compact BGA package. Its combination of 38,400 logic elements, 444 I/Os and approximately 0.276 Mbits of RAM enables consolidation of discrete logic and buffer functions into a single programmable device.

This device is well suited for engineers and teams developing commercial embedded products where board space, I/O count and predictable power/temperature characteristics are important. Backed by Microchip Technology’s ProASIC3E family documentation and support, it offers a clear, verifiable option for mid-density programmable logic needs.

Request a quote or submit an inquiry to our sales team to discuss availability, lead times and pricing for the M1A3PE1500-1FGG676. Technical and purchasing assistance is available to help integrate this FPGA into your design.