M1A3PE1500-1PQG208
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 757 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-1PQG208 – ProASIC3E Field Programmable Gate Array (FPGA) IC
The M1A3PE1500-1PQG208 is a ProASIC3E flash-based FPGA offering a mid-range logic density in a 208-BFQFP surface-mount package. It integrates approximately 38,400 logic elements and approximately 276,480 bits of on-chip RAM with 147 user I/O pins, providing a compact programmable fabric for embedded digital designs.
Engineered for commercial-grade applications, this device operates from a 1.425 V to 1.575 V core supply and supports an operating temperature range of 0 °C to 85 °C. Its combination of logic capacity, embedded memory and I/O count makes it suitable for a variety of control, interface and custom-logic tasks.
Key Features
- Core Logic — Approximately 38,400 logic elements delivering around 1,500,000 gates of programmable logic for implementing custom digital functions.
- Embedded Memory — Approximately 276,480 bits of on-chip RAM for buffering, FIFOs and small data stores directly inside the FPGA fabric.
- Programmable I/O — 147 user I/O pins suitable for connecting a wide range of peripherals and external logic.
- Package and Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level integration in compact form factors.
- Power — Core voltage supply specified at 1.425 V to 1.575 V, enabling predictable power planning in system designs.
- Temperature and Grade — Commercial grade device rated for ambient operation from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Embedded Control — Implement custom control logic, sequencing and protocol handling where moderate logic density and on-chip RAM are required.
- Interface Bridging — Act as a programmable interface between sensors, peripherals and microcontrollers using the device’s 147 I/O pins.
- Prototyping and Development — Validate digital designs and iterate on system logic with a flash-based FPGA fabric and substantial logic element count.
- Signal Processing — Implement compact, application-specific processing blocks that benefit from internal RAM and dense logic resources.
Unique Advantages
- Balanced Logic and Memory: Combines approximately 38,400 logic elements with about 276,480 bits of embedded RAM to support a wide range of mid-range digital functions without external memory.
- High I/O Count: 147 user I/Os provide flexibility for multiple peripheral connections and parallel interfaces, reducing the need for external glue logic.
- Compact, Surface-Mount Packaging: The 208-BFQFP package offers a board-friendly footprint for space-constrained applications while supporting surface-mount assembly.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match a broad set of commercial embedded applications.
- Predictable Power Planning: Narrow core voltage range (1.425 V–1.575 V) simplifies power-supply design and regulation choices.
- RoHS Compliant: Environmentally compliant for markets and supply chains that require lead-free components.
Why Choose M1A3PE1500-1PQG208?
The M1A3PE1500-1PQG208 positions itself as a practical, flash-based FPGA for commercial embedded designs that need a balance of logic capacity, embedded memory and a generous I/O count. Its 208-BFQFP surface-mount package and defined power and temperature ranges make it straightforward to integrate into production PCBs.
Designers seeking a programmable solution for control, interface, prototyping or signal-processing tasks will find the device’s combination of approximately 38,400 logic elements and approximately 276,480 bits of on-chip RAM well suited to mid-range digital implementations, with RoHS compliance supporting modern manufacturing requirements.
If you would like pricing, availability or a formal quote for M1A3PE1500-1PQG208, submit a request or sales inquiry and include your quantity and delivery requirements for a prompt response.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D