M1A3PE1500-2FG484
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 280 276480 484-BGA |
|---|---|
| Quantity | 1,673 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 280 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-2FG484 – ProASIC3E Field Programmable Gate Array (FPGA) IC, 280 I/O, 38,400 logic elements
The M1A3PE1500-2FG484 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology intended for commercial-grade programmable logic applications. It delivers a balance of on-chip logic density, I/O capacity and embedded memory suitable for a range of embedded designs.
Key attributes include 38,400 logic elements, approximately 1,500,000 gates of logic, 280 user I/O, and on-chip RAM, all provided in a compact 484-BGA surface-mount package with RoHS compliance.
Key Features
- Core / Logic 38,400 logic elements providing up to 1,500,000 gates of programmable logic for implementing custom digital functions.
- Embedded Memory Approximately 0.276 Mbits of embedded memory (276,480 total RAM bits) for on-chip buffering, FIFOs and state storage.
- I/O Capacity 280 user-accessible I/O pins to support multiple parallel interfaces and external peripherals.
- Power Operates from a nominal supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
- Package & Mounting 484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor for dense board layouts.
- Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory consistency.
Unique Advantages
- High logic density: 38,400 logic elements and 1,500,000 gates enable complex logic integration and consolidation of discrete components.
- Substantial on-chip memory: Approximately 0.276 Mbits of embedded RAM reduces external memory dependencies for many control and buffering tasks.
- Generous I/O count: 280 I/O pins support multiple parallel interfaces and flexible board-level integration options.
- Compact, manufacturable package: 484-BGA (23 × 23 FPBGA) surface-mount package facilitates high-density PCB design and automated assembly.
- Commercial temperature suitability: Rated 0 °C to 85 °C, matching the needs of a broad set of commercial applications.
- Regulatory alignment: RoHS compliance supports restrictions on hazardous substances in commercial product builds.
Why Choose M1A3PE1500-2FG484?
The M1A3PE1500-2FG484 positions itself as a commercially graded programmable logic platform that combines a substantial complement of logic elements, embedded memory and a high I/O count in a compact BGA package. These attributes allow designers to implement sizable custom digital functions and consolidate system-level logic while maintaining a small PCB footprint.
This device is appropriate for engineering teams and procurement looking for a Microchip ProASIC3E FPGA offering clear, verifiable specifications for logic capacity, memory, I/O and operating conditions, delivering predictable integration into commercial embedded designs with RoHS compliance.
Request a quote or submit a procurement inquiry to receive pricing and availability for the M1A3PE1500-2FG484.

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