M1A3PE1500-2FG484I

The M1A3PE1500-2FG484I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) IC offering 1,500,000 gates, 38,400 logic elements, and 280 I/O pins in a 484-ball FBGA package. It is supplied for industrial-grade designs that require substantial on-chip logic and embedded RAM while maintaining a compact, surface-mount footprint.

This device targets designs that need mid-range FPGA resources with deterministic supply and temperature ranges, enabling integration of complex logic functions and significant I/O count in a single component.

Key Features

• Core Logic — 1,500,000 gates and 38,400 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory — Approximately 276,480 bits of on-chip RAM for buffering, state storage, and intermediate data handling.
• I/O Density — 280 I/O pins to support high fan-out systems and multiple peripheral interfaces.
• Power — Single-core supply range specified at 1.425 V to 1.575 V for predictable power planning and supply selection.
• Package and Mounting — 484-FPBGA (23×23) package in a 484-BGA case, optimized for surface-mount assembly and compact board layouts.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliance — Manufactured to meet RoHS requirements for lead-free assembly environments.

Typical Applications

• I/O-Intensive Systems — Applications that require a high number of external connections can leverage the device’s 280 I/Os to consolidate interfaces on a single FPGA.
• Mid-Range Logic Integration — Designs needing up to 1.5M gates and 38,400 logic elements for implementing custom processing, glue logic, or protocol conversion.
• Industrial Equipment — Control and instrumentation systems that benefit from the device’s industrial temperature rating and surface-mount 484-FPBGA package.
• Embedded Memory-Dependent Designs — Systems that require embedded buffers or small on-chip storage can use the approximately 276,480 bits of RAM to reduce external memory dependence.

Unique Advantages

• High Logic Capacity: 1,500,000 gates and 38,400 logic elements enable substantial functional integration, reducing the need for multiple discrete devices.
• Significant On-Chip RAM: Approximately 276,480 bits of embedded memory support data buffering and local storage to simplify board-level memory architectures.
• Extensive I/O Count: 280 I/Os provide flexibility for multi-channel interfaces and peripheral connectivity without additional bridge components.
• Industrial Operation: Specified for −40 °C to 100 °C operation, suitable for a range of industrial deployment scenarios.
• Compact, Surface-Mount Package: 484-FPBGA (23×23) offers a dense footprint for space-constrained designs while supporting automated PCB assembly.
• RoHS Compliant: Built to meet lead-free manufacturing requirements for modern production environments.

Why Choose M1A3PE1500-2FG484I?

The M1A3PE1500-2FG484I combines substantial programmable logic resources, meaningful embedded RAM, and a high I/O count in a compact 484-FPBGA package rated for industrial temperatures. This configuration suits engineers and procurement teams seeking a single FPGA component to consolidate logic, reduce board complexity, and meet industrial deployment conditions.

With clear supply and thermal specifications, the device supports predictable power and thermal design choices and is appropriate for projects that require mid-range FPGA capacity and extensive I/O in a surface-mount form factor.

Request a quote or submit an inquiry to evaluate how M1A3PE1500-2FG484I can meet your design requirements and to obtain pricing and availability information.