M1A3PE1500-2FGG484

The M1A3PE1500-2FGG484 is a ProASIC3E Field Programmable Gate Array from Microchip Technology. It delivers a high-density programmable fabric with 1,500,000 gates and 38,400 logic elements in a compact 484-BGA package.

Engineered for designs that require substantial logic capacity, numerous I/Os, and embedded memory, this commercial-grade FPGA supports supply voltages from 1.425 V to 1.575 V and operates across a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity — 38,400 logic elements (LEs) providing programmable resources equivalent to 1,500,000 gates for complex logic implementations.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) for buffering, FIFOs, and small memory structures.
• I/O Count — 280 user I/Os to support multiple interfaces, parallel buses, and mixed-signal front ends.
• Package — 484-ball fine-pitch BGA (484-FPBGA, 23 × 23) in a surface-mount configuration for high-pin-count board designs.
• Power — Nominal core supply range of 1.425 V to 1.575 V to match system power rails.
• Temperature and Grade — Commercial operating range of 0 °C to 85 °C, suitable for consumer and general-purpose embedded applications.
• Compliance — RoHS-compliant component for regulatory and manufacturing consistency.

Typical Applications

• High-density digital processing — Implement custom datapaths and control logic using 38,400 logic elements and 1,500,000 gates.
• Interface bridging and protocol conversion — Use 280 I/Os to connect multiple peripherals, buses, or I/O standards within a single programmable device.
• Embedded control and glue logic — Leverage on-chip RAM and abundant logic to implement microcontroller support functions, state machines, and timing-critical control logic.

Unique Advantages

• High logic density: 38,400 logic elements provide the capacity to consolidate multiple functions and reduce BOM complexity.
• Generous I/O resources: 280 I/Os enable broad connectivity without external bus extenders or GPIO expanders.
• On-chip memory: Approximately 0.276 Mbits of embedded RAM supports buffering and localized data storage, reducing external memory needs.
• Compact high-pin-count package: 484-FPBGA (23×23) allows dense routing and efficient board layout for space-constrained systems.
• Designed for standard commercial systems: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance for mainstream electronics manufacturing.
• Consistent supply voltage: Core operation within 1.425 V–1.575 V aligns with common power architectures.

Why Choose M1A3PE1500-2FGG484?

The M1A3PE1500-2FGG484 positions itself as a high-density, commercially graded FPGA option suited for designs that demand significant programmable logic, ample I/O, and embedded memory within a compact BGA footprint. Its combination of 1,500,000 gates, 38,400 logic elements, and 280 I/Os makes it well suited for consolidating multiple functions and simplifying board-level architectures.

As a Microchip Technology ProASIC3E device, it offers designers a predictable commercial operating range and RoHS compliance, delivering scalability and integration for a wide range of embedded and digital processing projects.

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