M1A3PE1500-2FGG676I

The M1A3PE1500-2FGG676I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology featuring high logic density and extensive I/O in a compact 676-BGA package. It combines 1,500,000 gates and 38,400 logic elements with on-chip RAM to address demanding, reconfigurable digital designs.

Designed for industrial environments, the device supports a wide operating temperature range and low-voltage core operation, making it suitable for systems that require robust, high-density programmable logic and a large number of I/O connections.

Key Features

• Core Logic — 38,400 logic elements providing a total of 1,500,000 gates for complex programmable logic implementations.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 bits) to support buffering, state machines, and small data stores.
• I/O Capacity — 444 user I/O pins to accommodate extensive peripheral and bus interfacing requirements.
• Package — 676-ball BGA in a 27 × 27 mm supplier package (676-FBGA) for high pin-count routing in a space-efficient footprint.
• Power — Core voltage supply range of 1.425 V to 1.575 V for consistent low-voltage operation.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial deployment needs.
• Mounting & Compliance — Surface-mount package with RoHS compliance for standard PCB assembly and environmental requirements.

Typical Applications

• Industrial Control — Implement real-time control logic, custom state machines, and interface bridging in factory and process automation systems.
• Data Acquisition & Processing — Provide reconfigurable front-end processing and aggregation with abundant I/O and embedded RAM for buffering.
• Communications & Networking — Support complex protocol handling and I/O-heavy interfacing where high logic density and many pins are required.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1,500,000 gates enable implementation of complex, integrated functions that reduce external components.
• Large I/O Count: 444 I/Os simplify board-level design by accommodating many peripherals and interfaces without additional multiplexing hardware.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial-grade classification support deployment in demanding environments.
• Compact High-Pin Package: 676-BGA (27 × 27 mm) delivers high pin density in a compact footprint for space-constrained designs.
• Low-Voltage Core: Narrow core voltage range (1.425 V–1.575 V) supports uniform supply design and predictable power behavior.
• Regulatory Compliance: RoHS compliance supports environmental requirements for modern manufacturing and deployment.

Why Choose M1A3PE1500-2FGG676I?

The M1A3PE1500-2FGG676I positions itself as a high-density, industrial-grade FPGA solution that combines substantial logic capacity, extensive I/O, and embedded memory in a 676-BGA package. Its electrical and thermal ratings make it well suited for engineers designing industrial, communications, or data acquisition systems that demand reconfigurable logic with a large pin count.

For teams seeking scalability and board-level integration, this FPGA offers a balance of logic resources, on-chip RAM, and packaging that simplifies BOM and layout choices while meeting typical industrial operating conditions.

Request a quote or submit an inquiry to purchase the M1A3PE1500-2FGG676I and evaluate its fit for your next high-density, industrial FPGA design.