M1A3PE1500-2PQG208I

IC FPGA 147 I/O 208QFP
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP

Quantity 945 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O147Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of M1A3PE1500-2PQG208I – ProASIC3E Field Programmable Gate Array (FPGA), 147 I/Os, 208‑BFQFP

The M1A3PE1500-2PQG208I is a ProASIC3E Field Programmable Gate Array (FPGA) in a 208‑BFQFP package designed for programmable digital logic implementation. It delivers 38,400 logic elements and approximately 0.276 Mbits of embedded memory to support mid‑density logic and memory requirements.

With 147 available I/O, a device gate count of 1,500,000, industrial grade specification and an operating range from −40 °C to 100 °C, this FPGA suits designs that require a combination of logic capacity, significant I/O connectivity and robust operating temperature performance.

Key Features

  • Core Logic  Provides 38,400 logic elements to implement custom digital functions and moderate-density designs.
  • Embedded Memory  Contains 276,480 total RAM bits—approximately 0.276 Mbits—useful for FIFOs, buffers and small on-chip storage needs.
  • I/O Count  147 user I/Os enable broad connectivity for parallel interfaces, signal routing and I/O‑rich applications.
  • Gate Capacity  1,500,000 equivalent gates to describe the device’s overall logic complexity capability.
  • Power Supply  Operates from a core voltage supply range of 1.425 V to 1.575 V, supporting consistent power domain planning.
  • Package & Mounting  Supplied in a 208‑BFQFP (208‑PQFP, 28×28) package for surface‑mount PCB assembly.
  • Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant, meeting standard lead‑free environmental requirements.

Typical Applications

  • Industrial Control  Leverage industrial grade operation and wide temperature range for control systems and factory automation requiring reliable logic and I/O connectivity.
  • Embedded System Prototyping  Use the 38,400 logic elements and on‑chip RAM to prototype and validate custom digital functions and system logic.
  • I/O Expansion & Interface Bridging  High I/O count (147) makes the device suitable for interfacing multiple peripherals, buses or sensor arrays.
  • Communication & Data Handling  Combine logic capacity and embedded memory to implement protocol handling, buffering and data path functions.

Unique Advantages

  • Balanced Logic and Memory: 38,400 logic elements paired with approximately 0.276 Mbits of on‑chip RAM provide a practical balance for mid‑range designs without external memory dependency.
  • High I/O Density: 147 user I/Os allow flexible interfacing to multiple peripherals and parallel buses, reducing the need for external I/O expanders.
  • Industrial Robustness: Rated for −40 °C to 100 °C and classified as industrial grade for deployment in challenging ambient conditions.
  • Compact Surface‑Mount Package: 208‑BFQFP (28×28) package supports space‑conscious PCB layouts and established surface‑mount assembly processes.
  • Clear Power Specification: Defined core supply range (1.425 V–1.575 V) simplifies power supply design and integration.
  • Environmental Compliance: RoHS compliance supports regulatory and sustainability requirements.

Why Choose M1A3PE1500-2PQG208I?

The M1A3PE1500-2PQG208I positions itself as a mid‑density programmable solution that combines a substantial logic element count, integrated RAM and extensive I/O in a single industrial‑grade package. Its gate capacity and on‑chip resources make it suitable for engineers seeking to implement custom digital functions with reliable temperature performance and a defined core voltage domain.

This device is well suited for teams focused on embedded system development, industrial automation, and applications that require configurable I/O and moderate on‑chip memory. The combination of package, environmental rating and RoHS compliance delivers a pragmatic option for production designs that demand consistency and long‑term availability.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the M1A3PE1500-2PQG208I. Our team can assist with lead times, volume pricing and qualification details to support your design cycle.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up