M1A3PE1500-2PQG208I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 945 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-2PQG208I – ProASIC3E Field Programmable Gate Array (FPGA), 147 I/Os, 208‑BFQFP
The M1A3PE1500-2PQG208I is a ProASIC3E Field Programmable Gate Array (FPGA) in a 208‑BFQFP package designed for programmable digital logic implementation. It delivers 38,400 logic elements and approximately 0.276 Mbits of embedded memory to support mid‑density logic and memory requirements.
With 147 available I/O, a device gate count of 1,500,000, industrial grade specification and an operating range from −40 °C to 100 °C, this FPGA suits designs that require a combination of logic capacity, significant I/O connectivity and robust operating temperature performance.
Key Features
- Core Logic Provides 38,400 logic elements to implement custom digital functions and moderate-density designs.
- Embedded Memory Contains 276,480 total RAM bits—approximately 0.276 Mbits—useful for FIFOs, buffers and small on-chip storage needs.
- I/O Count 147 user I/Os enable broad connectivity for parallel interfaces, signal routing and I/O‑rich applications.
- Gate Capacity 1,500,000 equivalent gates to describe the device’s overall logic complexity capability.
- Power Supply Operates from a core voltage supply range of 1.425 V to 1.575 V, supporting consistent power domain planning.
- Package & Mounting Supplied in a 208‑BFQFP (208‑PQFP, 28×28) package for surface‑mount PCB assembly.
- Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant, meeting standard lead‑free environmental requirements.
Typical Applications
- Industrial Control Leverage industrial grade operation and wide temperature range for control systems and factory automation requiring reliable logic and I/O connectivity.
- Embedded System Prototyping Use the 38,400 logic elements and on‑chip RAM to prototype and validate custom digital functions and system logic.
- I/O Expansion & Interface Bridging High I/O count (147) makes the device suitable for interfacing multiple peripherals, buses or sensor arrays.
- Communication & Data Handling Combine logic capacity and embedded memory to implement protocol handling, buffering and data path functions.
Unique Advantages
- Balanced Logic and Memory: 38,400 logic elements paired with approximately 0.276 Mbits of on‑chip RAM provide a practical balance for mid‑range designs without external memory dependency.
- High I/O Density: 147 user I/Os allow flexible interfacing to multiple peripherals and parallel buses, reducing the need for external I/O expanders.
- Industrial Robustness: Rated for −40 °C to 100 °C and classified as industrial grade for deployment in challenging ambient conditions.
- Compact Surface‑Mount Package: 208‑BFQFP (28×28) package supports space‑conscious PCB layouts and established surface‑mount assembly processes.
- Clear Power Specification: Defined core supply range (1.425 V–1.575 V) simplifies power supply design and integration.
- Environmental Compliance: RoHS compliance supports regulatory and sustainability requirements.
Why Choose M1A3PE1500-2PQG208I?
The M1A3PE1500-2PQG208I positions itself as a mid‑density programmable solution that combines a substantial logic element count, integrated RAM and extensive I/O in a single industrial‑grade package. Its gate capacity and on‑chip resources make it suitable for engineers seeking to implement custom digital functions with reliable temperature performance and a defined core voltage domain.
This device is well suited for teams focused on embedded system development, industrial automation, and applications that require configurable I/O and moderate on‑chip memory. The combination of package, environmental rating and RoHS compliance delivers a pragmatic option for production designs that demand consistency and long‑term availability.
Request a quote or submit an inquiry to receive pricing, availability and technical support for the M1A3PE1500-2PQG208I. Our team can assist with lead times, volume pricing and qualification details to support your design cycle.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D