M1A3PE1500-FG484

The M1A3PE1500-FG484 is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 484-ball BGA package. It provides a combination of dense logic, on-chip embedded memory, and a high I/O count for commercial-grade embedded designs.

With 38,400 logic elements, approximately 0.276 Mbits of embedded RAM, and 280 I/Os, this surface-mount device is suited to applications that require substantial programmable logic capacity within a 23×23 484-FPBGA footprint. It operates from a 1.425–1.575 V supply and is specified for 0 °C to 85 °C commercial operating range.

Key Features

• Core Capacity  38,400 logic elements (cells) providing programmable fabric for custom logic and glue logic implementations.
• Logic Density  Approximately 1,500,000 gates of logic capacity to support medium-density FPGA designs.
• Embedded Memory  Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) for buffering, FIFOs, and small data storage needs.
• I/O Resources  280 available I/Os to support wide parallel interfaces, multiple peripheral connections, or high-pin-count board-level designs.
• Power  Single-core voltage supply range of 1.425 V to 1.575 V for core power planning and regulation design.
• Package & Mounting  484-ball FBGA (484-FPBGA, 23×23) package in a surface-mount form factor for compact PCB integration.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
• Environmental Compliance  RoHS compliant to support regulatory requirements for electronic assemblies.

Typical Applications

• I/O-Intensive Logic  Designs that require extensive parallel interfacing or multiple peripheral connections can leverage the 280 I/Os to consolidate board-level glue logic.
• Embedded Data Handling  Applications needing on-chip buffering or small FIFOs can use the device’s approximately 0.276 Mbits of embedded RAM alongside its logic elements.
• Mid-Density FPGA Implementations  Use cases that require around 38,400 logic elements and up to 1.5M gates of logic capacity for custom control, protocol bridging, or signal processing tasks.

Unique Advantages

• Balanced Logic and Memory:  Combines 38,400 logic elements with embedded RAM to implement both control logic and local data storage without external memory in many designs.
• High I/O Count:  280 I/Os reduce the need for external multiplexing and simplify interfacing to multiple peripherals or parallel buses.
• Compact BGA Package:  484-FPBGA (23×23) provides a high-pin-count solution in a compact surface-mount footprint to save PCB area.
• Commercial Temperature Rating:  Specified for 0 °C to 85 °C operation, aligning with standard commercial product requirements.
• Regulatory Compliance:  RoHS compliance supports environmental and manufacturing requirements for commercial electronics.

Why Choose M1A3PE1500-FG484?

The M1A3PE1500-FG484 positions itself as a mid-density, flash-based FPGA option that balances substantial logic resources, embedded RAM, and a high I/O count in a 484-BGA package. Its specification set—including 38,400 logic elements, approximately 0.276 Mbits of on-chip RAM, and 280 I/Os—makes it suitable for designers seeking a compact, commercially rated FPGA for complex glue logic, interface consolidation, and embedded data handling tasks.

Backed by Microchip Technology with datasheet documentation available, this ProASIC3E device is aimed at commercial embedded-product designs where predictable operating voltage, package footprint, and RoHS compliance are principal selection criteria.

If you would like pricing, availability, or need a formal quote for the M1A3PE1500-FG484, please submit a request or contact sales to receive further assistance.