M1A3PE1500-FG676I

The M1A3PE1500-FG676I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded designs. It delivers a balanced combination of programmable logic, on-chip memory and a large I/O complement for applications that require substantial logic capacity and dense external connectivity.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 444 user I/Os packaged in a 676-FBGA, this device targets industrial and embedded control applications that demand configurable digital logic, reliable operation across a wide temperature range and compact surface-mount packaging.

Key Features

• Logic Capacity  Provides 38,400 logic elements (equivalent logic resources) and approximately 1,500,000 gates to implement complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for buffering, state storage and small data structures within the FPGA fabric.
• High-Density I/O  444 user I/Os support dense external connectivity for interfacing with sensors, memory, peripherals and high-pin-count systems.
• Package and Mounting  Delivered in a 676-FBGA (27x27) surface-mount package for compact board integration and high pin-count routing.
• Power  Core supply voltage range of 1.425 V to 1.575 V for precise low-voltage operation and predictable power planning.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet the thermal demands of industrial and harsh-environment applications.
• Regulatory Compliance  RoHS compliant to support environmentally conscious production and regulatory requirements.

Typical Applications

• Industrial Control  Implements custom control logic, state machines and I/O aggregation in factory automation and process-control equipment.
• Embedded Systems  Provides programmable acceleration and interface bridging in embedded appliances and compute modules.
• Communications and Networking  Handles protocol processing, packet handling and high-density signal interfacing where many I/Os and flexible logic are needed.
• Instrumentation and Test  Enables configurable data acquisition front-ends, real-time preprocessing and custom timing logic in test equipment.

Unique Advantages

• Substantial Logic Resources: 38,400 logic elements and 1.5 million gates enable implementation of complex custom logic without external ASICs.
• Dense Connectivity: 444 user I/Os reduce the need for external expanders and simplify board-level interfaces to multiple peripherals and sensors.
• Compact, High-Pin-Count Package: The 676-FBGA (27x27) package provides a high pin count in a compact surface-mount footprint to save PCB area.
• Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployment in industrial and harsh-environment systems.
• Controlled Low-Voltage Core: Narrow core voltage range (1.425 V–1.575 V) simplifies power-supply design for consistent device behavior.
• RoHS Compliant: Facilitates environmentally compliant manufacturing and end-product shipment.

Why Choose M1A3PE1500-FG676I?

The M1A3PE1500-FG676I positions itself as a compact, industrial-grade FPGA option for engineers who need substantial logic density, a high number of I/Os and predictable operation across a wide temperature range. Its combination of 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 444 user I/Os makes it suitable for designs that require flexible digital implementation while keeping board area and component count under control.

Designed for industrial embedded applications, this ProASIC3E device is appropriate for teams building control systems, communication interfaces and instrumentation that demand configurable hardware, robust temperature performance and a high pin-count package from a recognized manufacturer.

Request a quote or contact sales to discuss pricing, availability and to obtain procurement-level information for the M1A3PE1500-FG676I.