M1A3PE1500-FGG676I

The M1A3PE1500-FGG676I is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology in a 676-ball BGA package. It provides a high-density programmable fabric with a large I/O count and on-chip RAM targeted at industrial and embedded applications.

With 38,400 logic elements, 444 I/Os, approximately 0.276 Mbits of embedded memory and a supply range of 1.425 V to 1.575 V, this device is designed for designs that require significant gate capacity and dense I/O within a surface-mount footprint. The device is rated for an operating range of −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Capacity: 1,500,000 gates and 38,400 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory: Approximately 0.276 Mbits of on-chip RAM to support local buffering, state machines, and small data storage needs.
• I/O Density: 444 I/Os to support dense peripheral interfacing and multiple parallel connections.
• Power: Operates from a 1.425 V to 1.575 V supply range to meet the device's core voltage requirements.
• Package & Mounting: 676-BGA package (supplier device package: 676-FBGA (27×27)), surface-mount mounting type for compact PCB integration.
• Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Regulatory Compliance: RoHS compliant for environmental and lead-free assembly requirements.

Typical Applications

• Industrial Control: High gate count and wide operating temperature range make the device suitable for industrial automation, motor control logic, and factory instrumentation interfaces.
• Embedded Systems: Dense I/O and on-chip RAM support embedded processing glue logic, peripheral aggregation, and custom buses.
• Communications & Networking: Large logic capacity and numerous I/Os enable protocol implementation, parallel data paths, and interface bridging in communication equipment.
• Test & Measurement: Programmable fabric and abundant I/Os are useful for custom signal routing, trigger logic, and data acquisition front ends.

Unique Advantages

• High Logic Density: 1,500,000 gates and 38,400 logic elements provide headroom for complex functions without external glue logic.
• Extensive I/O Count: 444 I/Os allow direct connection to multiple peripherals and parallel interfaces, reducing the need for external expanders.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions common in industrial applications.
• Compact Surface-Mount Package: 676-BGA / 676-FBGA (27×27) package balances high pin-count with a space-efficient footprint for PCB-constrained designs.
• Controlled Supply Range: Narrow core supply window (1.425 V to 1.575 V) simplifies power-rail design for consistent operation.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing and environmental standards.

Why Choose M1A3PE1500-FGG676I?

The M1A3PE1500-FGG676I delivers a combination of high gate capacity, substantial I/O density, and industrial temperature rating, making it well suited for engineers building complex embedded and industrial systems that require on-board programmability and robust I/O support. Its surface-mount 676-BGA footprint enables compact PCBs while preserving connectivity and logic resources.

Designed and manufactured by Microchip Technology, this ProASIC3E device targets applications that need scalable programmable logic, reliable operation across a wide temperature range, and RoHS-compliant manufacturing. It is a practical choice for teams focused on integration, long-term deployment, and high-density interfacing.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE1500-FGG676I. Our team can provide the details you need to evaluate this device for your design.