M1A3PE1500-PQG208
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 276480 208-BFQFP |
|---|---|
| Quantity | 1,260 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C ~ 85°C (TJ) | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425V ~ 1.575V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of M1A3PE1500-PQG208 – ProASIC3E FPGA, 147 I/O, ~0.28 Mbits RAM, 208‑BFQFP
The M1A3PE1500-PQG208 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology designed for commercial electronic designs. It provides programmable logic capacity and on-chip embedded memory in a surface-mount 208‑lead package for integration into a wide range of board-level applications.
With a defined supply range and commercial operating temperature, the device targets designers who need a programmable logic element with substantial I/O and memory resources while maintaining RoHS compliance.
Key Features
- Logic Capacity Approximately 38,400 logic elements providing up to 1,500,000 gates of programmable logic for implementing custom logic, glue functions, and control modules.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM (276,480 total RAM bits) for buffering, FIFOs, and small data storage within designs.
- I/O Count 147 user I/O pins to support multiple interfaces and external device connections on a single device.
- Supply Voltage Operates from 1.425 V to 1.575 V, enabling deterministic logic supply design and power planning.
- Package & Mounting Surface-mount 208‑BFQFP package (supplier device package: 208‑PQFP, 28×28) for board-level integration where a high pin-count, leaded QFP footprint is required.
- Operating Range & Grade Commercial grade operation from 0 °C to 85 °C suitable for standard commercial environments.
- Compliance RoHS compliant to support regulatory requirements for lead-free assembly.
Typical Applications
- Commercial Embedded Systems Use the device’s 38,400 logic elements and 147 I/O to implement control, interfacing, and custom logic in commercial electronic products within the 0 °C to 85 °C range.
- Custom I/O and Glue Logic Deploy the FPGA to consolidate discrete logic and interface translation using on-chip gates and abundant I/O pins.
- Data Buffering and Small Memory Tasks Leverage approximately 0.28 Mbits of embedded RAM for short-term buffering, small FIFOs, and parameter storage close to logic functions.
Unique Advantages
- High Logic Density: Approximately 38,400 logic elements and 1,500,000 gates allow implementation of complex custom logic while reducing external components.
- Significant I/O Count: 147 I/O pins support multiple peripheral connections and system interfaces from a single device, simplifying board routing and integration.
- Compact, Board-Friendly Package: 208‑lead BFQFP surface-mount package (208‑PQFP, 28×28) provides high pin count in a well-known QFP footprint for many PCB layouts.
- Defined Power Envelope: Narrow supply range (1.425 V–1.575 V) simplifies power supply design and margin planning for the core logic.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial deployments where that ambient range applies.
- RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.
Why Choose M1A3PE1500-PQG208?
The M1A3PE1500-PQG208 positions itself as a commercially graded, programmable logic building block offering a balance of logic density, on-chip memory, and high I/O count in a 208‑lead QFP package. It is suited to designers who need measurable logic and memory resources in a surface-mount FPGA that fits common PCB form factors.
For teams developing commercial embedded systems, interface consolidation, or custom control logic, this device provides verifiable capacity and package options that support scalable designs and RoHS-compliant manufacturing.
Request a quote or submit a pricing inquiry to evaluate the M1A3PE1500-PQG208 for your next design.

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