M1A3PE3000-1FG324I

The M1A3PE3000-1FG324I is a Field Programmable Gate Array (FPGA) from Microchip Technology, delivering high logic density and extensive I/O in a compact BGA package. It integrates 75,264 logic elements and approximately 0.516 Mbits of embedded memory to support complex digital logic implementations.

Designed for industrial-grade applications, this device provides a wide operating temperature range and a robust I/O count, making it suitable for systems that require substantial on-chip resources, flexible interfacing, and reliable operation across -40°C to 100°C.

Key Features

• Logic Density  Contains 3,000,000 gates and 75,264 logic elements to implement large-scale custom logic and control functions.
• On-Chip Memory  Approximately 0.516 Mbits (516,096 bits) of embedded RAM for local buffering, state storage, and data manipulation.
• High I/O Count  221 user I/O pins provide extensive interfacing capability for sensors, actuators, and external peripherals.
• Power and I/O Supply  Operates from a supply voltage range of 1.425 V to 1.575 V to match system power envelopes.
• Package & Mounting  324-BGA (supplier package: 324-FBGA 19×19) in a surface-mount form factor for space-efficient board integration.
• Industrial Temperature Range  Specified operating temperature from -40°C to 100°C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Leverage the device’s industrial temperature rating and large I/O count for motor control, PLC I/O expansion, and factory automation interfaces.
• Communications & Networking  Use its high logic density and on-chip memory for protocol processing, packet buffering, and custom data-path logic.
• Sensor and Data Aggregation  The combination of many I/Os and embedded RAM supports multi-sensor aggregation, preprocessing, and real-time control tasks.

Unique Advantages

• High Integration: 3,000,000 gates and 75,264 logic elements reduce external logic requirements and simplify system design.
• Meaningful On-Chip Memory: Approximately 0.516 Mbits of embedded RAM enables local buffering and state retention without immediate external memory.
• Extensive I/O Resource: 221 user I/Os allow direct interfacing to numerous peripherals and parallel data channels.
• Industrial Robustness: Rated for -40°C to 100°C operation and supplied in a surface-mount 324-BGA package suitable for compact, reliable assemblies.
• Controlled Power Range: Tight voltage supply window (1.425 V–1.575 V) supports predictable power planning in multi-rail systems.
• Environmental Compliance: RoHS compliance supports environmentally conscious manufacturing and deployment.

Why Choose M1A3PE3000-1FG324I?

The M1A3PE3000-1FG324I positions itself as a high-density FPGA option for engineers needing significant logic and I/O resources in an industrial-capable package. Its combination of 75,264 logic elements, substantial on-chip RAM, and 221 I/Os makes it suited to designs that require complex custom logic, multiple interfaces, and reliable operation across wide temperature ranges.

Backed by Microchip Technology, this device delivers the component-level attributes—density, I/O flexibility, package compactness, and RoHS compliance—required by teams building industrial control, communications, and sensor-processing systems.

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