M1A3PE3000-1FG324

The M1A3PE3000-1FG324 is a ProASIC3E field programmable gate array (FPGA) in a 324-ball BGA package designed for commercial electronic applications. It integrates a large logic fabric with on-chip memory and extensive I/O in a surface-mount footprint.

Key device characteristics include 75,264 logic elements, approximately 0.52 Mbits of embedded memory (516,096 bits), 221 I/O pins, and an internal gate count of 3,000,000. The device operates from a 1.425 V to 1.575 V supply and is rated for commercial temperatures from 0 °C to 85 °C; it is RoHS compliant.

Key Features

• Logic Capacity  Approximately 75,264 logic elements provide significant programmable logic resources for complex designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM (516,096 bits) supports buffering, state storage, and intermediate data processing.
• I/O Resources  221 general-purpose I/O pins allow broad interfacing options for external peripherals and system signals.
• Gate Count  A design capacity of 3,000,000 gates for implementing dense logic and glue-logic functions.
• Package & Mounting  324-ball BGA (324-FBGA, 19×19) in a surface-mount configuration for compact board-level integration.
• Power Supply  Operates from a defined core voltage range of 1.425 V to 1.575 V to match targeted power-rail designs.
• Commercial Grade & Temperature  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• RoHS Compliance  RoHS-compliant manufacturing status for environmental compliance in commercial electronics.

Unique Advantages

• High logic density: 75,264 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• On-chip RAM for local data handling: Approximately 0.52 Mbits of embedded memory supports efficient buffering and state retention without external memory.
• Extensive I/O count: 221 I/O pins provide flexibility for interfacing with numerous peripherals and system buses.
• Compact BGA package: The 324-ball FBGA (19×19) package delivers a space-efficient solution for dense PCB layouts while supporting surface-mount assembly.
• Clear power and thermal parameters: Specified supply range (1.425–1.575 V) and commercial temperature rating simplify power-system and thermal planning for typical commercial designs.
• Regulatory/environmental readiness: RoHS compliance supports environmental requirements for commercial products.

Why Choose M1A3PE3000-1FG324?

The M1A3PE3000-1FG324 positions itself as a high-capacity ProASIC3E FPGA for commercial designs that require substantial programmable logic, embedded memory, and a large number of I/Os in a compact BGA footprint. Its defined supply voltage range, commercial temperature rating, and RoHS compliance make it suitable for mainstream electronic products where those specifications match system requirements.

Manufactured by Microchip Technology, this device offers a combination of logic density and integration that supports consolidation of functions on a single FPGA, aiding in BOM reduction and simplified board design for commercial applications.

Request a quote or submit a procurement inquiry to receive pricing and availability information for M1A3PE3000-1FG324 and to discuss how this ProASIC3E FPGA can fit into your next design.