M1A3PE3000-1FG896

The M1A3PE3000-1FG896 is a ProASIC3E family FPGA IC designed for commercial electronic systems requiring high logic capacity and extensive I/O. It combines 75,264 logic elements with approximately 0.52 Mbits of embedded memory and 620 general-purpose I/O pins to support complex glue logic, interface consolidation, and custom digital functions.

Packaged in a compact 896-ball FBGA (31 × 31) with surface-mount mounting, this device operates from a 1.425 V to 1.575 V supply and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic Capacity 75,264 logic elements (equivalent) and approximately 3,000,000 gates provide substantial on-chip programmable logic for high-density designs.
• Embedded Memory Approximately 0.52 Mbits of total on-chip RAM for buffering, lookup tables, and small data storage requirements.
• High I/O Count 620 I/O pins enable broad connectivity for parallel interfaces, multiple peripherals, and extensive board-level routing.
• Package and Mounting 896-FBGA (31 × 31) package in an 896-ball BGA footprint with surface-mount mounting for compact board integration.
• Power Supply Low-voltage core supply range of 1.425 V to 1.575 V to match modern FPGA power rails.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial system deployments.
• RoHS Compliant Conforms to RoHS environmental requirements.

Typical Applications

• Embedded System Control Implement custom control logic and state machines for commercial electronic products.
• Interface and I/O Aggregation Consolidate multiple digital interfaces and peripheral connections using the device's large I/O count.
• Prototyping and Development Develop and validate complex digital functions where high logic density and flexible I/O are required.
• Signal Processing and Glue Logic Implement intermediate processing, timing adaptation, and protocol bridging in commercial equipment.

Unique Advantages

• High Logic Density: 75,264 logic elements and roughly 3,000,000 gates support complex designs without immediate need for multi-chip solutions.
• Extensive I/O Capacity: 620 I/O pins enable direct interfacing to many peripherals and buses, reducing external glue logic.
• Compact BGA Package: 896-FBGA (31 × 31) provides a high-pin-count solution in a space-efficient form factor for dense board layouts.
• Low-Voltage Operation: Core supply range of 1.425 V to 1.575 V aligns with contemporary low-voltage system architectures.
• Commercial Temperature Suitability: Specified 0 °C to 85 °C operation for mainstream commercial product deployments.
• RoHS Compliance: Facilitates environmental compliance in product designs.

Why Choose M1A3PE3000-1FG896?

The M1A3PE3000-1FG896 is positioned for commercial product designs that require a combination of high logic capacity, significant embedded memory, and a very large I/O count in a compact BGA package. Its specification set supports consolidation of multiple digital functions and high-density interfacing while operating on a low-voltage core supply.

This device is well suited to engineers and designers building complex commercial systems who need scalable logic resources, robust I/O capability, and a compact board footprint, all within the commercial temperature range and RoHS compliance.

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