M1A3PE3000-1FGG484

The M1A3PE3000-1FGG484 is a ProASIC3E field programmable gate array (FPGA) in a 484‑ball fine‑pitch BGA package. It provides a substantial programmable logic fabric with embedded memory and a high pin count for applications that require configurable digital logic and dense I/O integration.

With 75,264 logic elements, approximately 0.5 Mbits of embedded memory and 341 user I/O, this device is positioned for commercial designs where on‑chip resources, compact surface‑mount packaging, and controlled supply/temperature ranges are important.

Key Features

• Core Logic — 75,264 logic elements (cells) and 3,000,000 gates provide a large programmable fabric for custom digital functions and complex logic implementations.
• Embedded Memory — Approximately 0.5 Mbits (516,096 bits) of on‑chip RAM to implement FIFOs, buffers, and small data storage without external memory.
• I/O Capacity — 341 user I/Os for high‑density interfacing to peripherals, sensors, and external devices.
• Power Supply — Operates from a supply voltage range of 1.425 V to 1.575 V, enabling integration into designs with narrowly specified core rails.
• Package & Mounting — 484‑ball FPBGA (23×23) package optimized for surface‑mount assembly, providing a compact footprint for board‑level integration.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant for meeting common lead‑free requirements in commercial electronic products.

Typical Applications

• Custom Digital Logic — Implement application‑specific processing, protocol handling, and glue logic using the available logic elements and embedded memory.
• Interface Bridging — Use the 341 I/Os to bridge between multiple buses or to adapt legacy and modern interfaces on a single board.
• Control and Monitoring — Deploy in commercial control systems where on‑chip resources and compact packaging simplify PCB layout and reduce external components.

Unique Advantages

• Substantial Logic Capacity: 75,264 logic elements and 3,000,000 gates allow implementation of complex, multi‑functional designs without immediate need for larger devices.
• Built‑in Memory: Approximately 0.5 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage, simplifying BOM and board routing.
• High I/O Count: 341 user I/Os enable dense peripheral connectivity and flexible pinout assignments for varied interface requirements.
• Compact BGA Package: 484‑ball FPBGA (23×23) provides a space‑efficient solution for surface‑mount assemblies while supporting large I/O counts.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match commercial‑grade application environments.
• Regulatory Compatibility: RoHS compliance supports lead‑free assembly and related supply‑chain requirements.

Why Choose M1A3PE3000-1FGG484?

The M1A3PE3000-1FGG484 delivers a balance of logic density, embedded memory, and high I/O availability in a compact 484‑BGA package, making it suitable for commercial designs that require configurable hardware, dense interfacing, and a reduced external component count. Its defined supply voltage range and commercial operating temperature make it straightforward to integrate into standard embedded and control boards.

This ProASIC3E device is ideal for engineers seeking a programmable solution that consolidates logic and memory on‑chip while maintaining a form factor optimized for surface‑mount production. Its combination of resources supports scalable designs and long‑term maintainability within commercial product lifecycles.

Request a quote or submit an inquiry to receive pricing and availability for the M1A3PE3000-1FGG484 and to discuss your design requirements.