M1A3PE3000-1FGG484I

The M1A3PE3000-1FGG484I is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology, offering high logic density and substantial embedded memory in a compact BGA package. It is specified for industrial-grade applications and provides a broad I/O count and on-chip resources suited to complex programmable logic tasks.

Key attributes include 75,264 logic elements, approximately 0.52 Mbits of embedded memory, 341 I/O pins, and operation across a supply range of 1.425 V to 1.575 V and temperatures from -40 °C to 100 °C, all in a 484-FPBGA (23×23) surface-mount package.

Key Features

• Core Logic 75,264 logic elements delivering a total of 3,000,000 gates to implement complex programmable logic functions.
• Embedded Memory Approximately 0.52 Mbits (516,096 bits) of on-chip RAM to support data buffering, state storage, and local memory needs.
• High I/O Count 341 general-purpose I/O pins for extensive interfacing to peripherals, sensors, buses, and external devices.
• Package and Mounting 484-FPBGA (23×23) package in a surface-mount form factor, providing a compact footprint for board-level integration.
• Power Supply Operation from a defined core supply range of 1.425 V to 1.575 V to match system power design requirements.
• Industrial Temperature Range Qualified for operation from -40 °C to 100 °C to meet the environmental demands of industrial applications.
• Manufacturer Produced by Microchip Technology, ensuring consistent sourcing from an established semiconductor supplier.
• Standards Compliance RoHS compliant for regulatory and environmental requirements.

Typical Applications

• Industrial Control Programmable logic and interfacing in industrial systems where extended temperature range and high I/O counts are required.
• Embedded Processing and Glue Logic Implement custom datapath logic, protocol bridging, and system-level glue logic using the device's logic elements and on-chip RAM.
• High-Density I/O Systems Systems that require many external signals and peripheral connections can leverage the 341 available I/O pins.

Unique Advantages

• High Logic Density: 75,264 logic elements and 3,000,000 gates provide extensive resources for complex designs without external logic.
• Compact, Board-Friendly Package: The 484-FPBGA (23×23) surface-mount package balances high pin count with a manageable PCB footprint for space-constrained systems.
• Generous I/O Availability: 341 I/O pins enable broad connectivity to peripherals, sensors, and external interfaces, reducing the need for additional multiplexing.
• Industrial Operating Range: Rated from -40 °C to 100 °C to support deployment in harsher operating environments.
• On-Chip Memory: Approximately 0.52 Mbits of embedded RAM supports local buffering and state storage, simplifying system memory architectures.
• Clear Power Specification: Defined supply window of 1.425 V to 1.575 V helps simplify power design and margining for the core domain.

Why Choose M1A3PE3000-1FGG484I?

The M1A3PE3000-1FGG484I positions itself as a robust, industrial-grade FPGA solution combining high logic capacity, substantial on-chip memory, and a large number of I/O in a compact 484-BGA package. Its temperature and supply specifications make it suitable for demanding embedded and industrial projects that require reliable programmable logic resources.

Designed and manufactured by Microchip Technology, this device is well suited for designers and procurement teams seeking a high-density, industrial-capable FPGA for mid- to large-scale logic implementations where board space, I/O count, and environmental tolerance are key considerations.

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