M1A3PE3000-1PQ208I

The M1A3PE3000-1PQ208I is a ProASIC3E flash-based FPGA from Microchip Technology designed for industrial applications. It provides a balance of programmable logic, on-chip embedded memory and a sizable I/O count to support mid- to high-density designs that require non-volatile FPGA functionality.

With 75,264 logic elements, approximately 0.516 Mbits of embedded memory and 147 I/O pins in a 208-BFQFP surface-mount package, this device targets applications that need deterministic configuration retention, robust operating temperature range and a compact package footprint.

Key Features

• Core Logic  75,264 logic elements (cells) and a 3,000,000-gate equivalent capacity provide substantial programmable logic resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM (516,096 bits) for data buffering, state storage and small embedded memory needs.
• I/O Resources  147 I/O pins to support a variety of external interfaces and parallel or multiplexed signal connections.
• Power  Supported core voltage range from 1.425 V to 1.575 V for defined power-supply integration.
• Package & Mounting  208-BFQFP (supplier package listed as 208-PQFP 28×28) in a surface-mount configuration for board-level assembly and compact PCB layouts.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C suitable for commercial and industrial environments.
• Environmental Compliance  RoHS compliant for use in lead-free manufacturing processes.

Typical Applications

• Industrial Control  Implement control logic and custom state machines where industrial temperature range and non-volatile FPGA configuration are required.
• Embedded Systems  Use the device for embedded processing glue logic, protocol bridging or peripheral control leveraging 75,264 logic elements and available on-chip RAM.
• Data Acquisition & I/O Management  Manage multiple sensor or actuator interfaces using the 147 I/O pins for parallel and multiplexed signal handling.
• Prototyping & Custom Logic  Develop and validate mid-density digital designs in a compact 208-BFQFP surface-mount package.

Unique Advantages

• Substantial Logic Capacity: 75,264 logic elements enable integration of complex digital functions without external gate arrays.
• On-Chip Memory: Approximately 0.516 Mbits of embedded RAM reduces the need for external memory for buffering and small data storage tasks.
• High I/O Count: 147 I/Os provide flexible connectivity for multi-channel interfaces and mixed-signal front ends.
• Industrial Temperature Range: Qualified for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Compact Surface-Mount Package: 208-BFQFP (208-PQFP 28×28) supports dense PCB layouts while maintaining board-level manufacturability.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for regulatory and supply-chain compatibility.

Why Choose M1A3PE3000-1PQ208I?

The M1A3PE3000-1PQ208I offers a combination of significant programmable logic, embedded memory and a large I/O count in an industrial-grade, surface-mount package from Microchip Technology. Its defined core voltage range and extended operating temperature make it suitable for designs that require reliable, non-volatile FPGA behavior across commercial and industrial environments.

This device is well suited to engineers and organizations building mid-density FPGA designs that need on-chip RAM, numerous I/Os and a compact 208-BFQFP footprint. Backed by Microchip Technology and RoHS compliance, it provides a verifiable option for production designs that must meet environmental and manufacturing requirements.

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