M1A3PE3000-2FG324

The M1A3PE3000-2FG324 is a ProASIC3E family Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded applications. It combines a large logic resource set with on-chip RAM and a high I/O count in a 324-ball BGA package to support compact, high-density custom logic implementations.

This device is suitable for commercial-grade systems that require configurable digital logic, significant gate capacity, and substantial I/O integration while operating within a 0 °C to 85 °C temperature range and a 1.425 V to 1.575 V supply window.

Key Features

• Core Logic Capacity  75,264 logic elements with a total of 3,000,000 gates to support complex programmable designs and extensive custom logic.
• On-Chip Memory  516,096 bits of embedded RAM (approximately 0.52 Mbits) for local data storage, buffering, and state machines.
• I/O Integration  221 user I/O pins to support wide external connectivity and multiple interface implementations.
• Supply Voltage  Operates from 1.425 V to 1.575 V, enabling predictable power domain planning for system designs.
• Package and Mounting  324-ball BGA package (supplier package: 324-FBGA, 19 × 19) in a surface-mount form factor for compact board integration.
• Commercial Grade and Temperature  Rated for commercial applications with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom logic and control functions in commercial electronic products using the device's 75,264 logic elements and 221 I/O pins.
• High-Density I/O Interfaces  Consolidate multiple interface channels and signal conditioning paths thanks to the large I/O count and programmable logic resources.
• On-Board Data Processing  Handle local buffering and intermediate data manipulation with the device's approximately 0.52 Mbits of embedded RAM.

Unique Advantages

• Significant Logic Resources: 75,264 logic elements and 3,000,000 gates enable substantial custom logic implementation without external ASICs.
• Integrated RAM Capacity: 516,096 bits of on-chip RAM reduce dependence on external memory for many buffering and state tasks.
• Extensive I/O Count: 221 I/O pins provide flexibility for complex interfacing and multi-channel designs.
• Compact BGA Package: 324-ball BGA (324-FBGA, 19 × 19) minimizes PCB footprint while supporting high pin density.
• Commercial Design Fit: Rated for 0 °C to 85 °C and RoHS compliant, making it suitable for mainstream commercial products.
• Predictable Power Domain: Narrow supply range (1.425 V–1.575 V) simplifies power planning for regulated systems.

Why Choose M1A3PE3000-2FG324?

The M1A3PE3000-2FG324 positions itself as a high-capacity, commercially graded FPGA choice for designers needing extensive programmable logic, embedded RAM, and a large number of I/O in a compact BGA package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of on-chip RAM, and 221 I/O pins supports a wide range of configurable digital functions within commercial temperature limits.

This device is well suited to customers developing commercial embedded systems that require scalable logic resources, board-level integration in a surface-mount BGA form factor, and compliance with RoHS manufacturing requirements.

Request a quote or submit an inquiry to purchase the M1A3PE3000-2FG324 and evaluate how its logic capacity and I/O integration fit your next commercial design.