M1A3PE3000-2FG484I

The M1A3PE3000-2FG484I is a ProASIC3E FPGA from Microchip Technology designed to deliver substantial logic capacity and flexible I/O in a compact ball-grid array package. This device provides 3,000,000 gates, approximately 75,264 logic elements and roughly 0.516 Mbits of on-chip RAM, making it suitable for complex digital designs that require significant gate density and embedded memory.

With 341 user I/Os, a 484‑BGA (484‑FPBGA, 23×23) package, and an industrial operating range, the part is optimized for board-level integration where high I/O count, logic resources and temperature tolerance are important considerations.

Key Features

• Core Logic  3,000,000 gates and approximately 75,264 logic elements provide substantial capacity for complex logic implementation.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density  341 user I/O pins for broad interfacing options with external peripherals and system signals.
• Package and Mounting  484‑BGA (484‑FPBGA, 23×23) package in a surface-mount form factor for high-density PCB layouts.
• Power  Operates from a core supply range of 1.425 V to 1.575 V.
• Temperature and Grade  Industrial grade device rated for operation from −40°C to 100°C.
• Compliance  RoHS compliant.
• Manufacturer  Produced by Microchip Technology.

Typical Applications

• Industrial Control  Suitable for control systems and automation equipment that require industrial temperature operation and robust logic capacity.
• High‑Density Logic Integration  Use in designs that need multi-million‑gate capacity and tens of thousands of logic elements to consolidate complex functions onto a single device.
• Memory‑Assisted Processing  Ideal for architectures that leverage on‑chip RAM (approximately 0.516 Mbits) for buffering, local data storage or state machines.
• Board‑Level I/O Expansion  High I/O count (341 pins) supports systems requiring many external interfaces while maintaining a compact 484‑BGA footprint.

Unique Advantages

• High Logic Density:  3,000,000 gates and ~75,264 logic elements allow consolidation of complex digital functions, reducing the need for multiple discrete devices.
• Substantial On‑Chip Memory:  Approximately 0.516 Mbits of embedded RAM supports local data handling and efficient implementation of stateful logic.
• Extensive I/O:  341 user I/Os provide flexibility for interfacing to sensors, peripherals and external subsystems without excessive board routing complexity.
• Compact, High‑Pin Package:  484‑BGA (484‑FPBGA, 23×23) surface‑mount package enables high pin count and dense PCB integration in a compact footprint.
• Industrial‑Range Operation:  Rated for −40°C to 100°C and designated industrial grade for applications requiring extended temperature tolerance.
• RoHS Compliant:  Conforms to RoHS requirements for environmentally conscious designs.

Why Choose M1A3PE3000-2FG484I?

The M1A3PE3000-2FG484I positions itself as a high-capacity FPGA option for designs that demand multi-million gate resources, extensive I/O connectivity and on‑chip memory within a compact BGA package. Its industrial temperature rating and surface-mount 484‑BGA package make it suitable for board-level applications where space, thermal range and integration density matter.

Engineers targeting consolidation of complex logic, buffering-intensive tasks, or high‑pin-count interfacing will find the combination of 3,000,000 gates, ~75,264 logic elements, 341 I/Os and ~0.516 Mbits of RAM useful for reducing BOM complexity while maintaining a compact PCB footprint.

Request a quote or submit an inquiry to receive pricing and availability information for the M1A3PE3000-2FG484I ProASIC3E FPGA from Microchip Technology.