M1A3PE3000-2FG324I

The M1A3PE3000-2FG324I is a ProASIC3E Field Programmable Gate Array (FPGA) IC from Microchip Technology supplied in a 324‑BGA package. It delivers a substantial logic capacity and on‑chip memory in a compact, surface‑mount package suitable for industrial applications.

With 75,264 logic elements, 221 user I/Os and approximately 0.52 Mbits of embedded memory, this device targets designs that require moderate logic density, significant I/O connectivity and industrial temperature operation while maintaining a compact PCB footprint.

Key Features

• Logic Capacity  75,264 logic elements (cells) provide the core programmable resources for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.52 Mbits of on‑chip RAM (516,096 total RAM bits) for data buffering, state storage and small lookup tables.
• I/O Density  221 user I/O pins enable broad external device connectivity and interface implementation without external multiplexing.
• Gate Count  3,000,000 gates to describe the device’s overall integration scale for system designers.
• Power Supply  Operates from a single core supply in the range 1.425 V to 1.575 V, simplifying power rail planning for the core domain.
• Package & Mounting  324‑FBGA (19×19) footprint in a 324‑BGA package; surface‑mount mounting for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting deployment in a wide range of industrial environments.
• Compliance  RoHS‑compliant material status for environmental and regulatory alignment.

Typical Applications

• Industrial Control  Implement custom control logic, sequencing and interface bridging in industrial automation equipment where industrial temperature operation is required.
• Embedded Systems  Provide programmable glue logic, protocol adaptation and peripheral control in embedded platforms leveraging the device’s high I/O count and logic capacity.
• Communications and Interface  Realize protocol converters, parallel/serial interface logic and custom timing blocks using the available I/Os and on‑chip memory.

Unique Advantages

• High Logic Integration: 75,264 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant On‑Chip Memory: Approximately 0.52 Mbits of embedded RAM provides local storage for buffering and state machines without additional external memory.
• Extensive I/O Capability: 221 user I/Os support a wide range of external interfaces and reduce the need for external multiplexers or expansion logic.
• Compact Surface‑Mount Package: 324‑FBGA (19×19) offers a space-efficient solution for dense PCB layouts while maintaining a high pin count.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet environmental requirements for industrial deployments.
• RoHS Compliance: Materials and construction meet RoHS requirements for environmental compliance and streamlined regulatory handling.

Why Choose M1A3PE3000-2FG324I?

The M1A3PE3000-2FG324I balances considerable logic density, embedded memory and a high I/O count in a compact 324‑BGA package, making it well suited for industrial and embedded system designs that need programmable flexibility without large board area. Its specified operating voltage range and industrial temperature rating support consistent operation in demanding environments.

Designed and manufactured by Microchip Technology, this ProASIC3E FPGA option provides a field‑programmable platform for customers seeking a durable, integrated solution for custom digital logic, interfacing and control tasks with long‑term availability considerations.

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