M1A3PE3000-1PQG208I

IC FPGA 147 I/O 208QFP
Part Description

ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

Quantity 1,135 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O147Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs75264Number of Logic Elements/Cells75264
Number of Gates3000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits516096

Overview of M1A3PE3000-1PQG208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP

The M1A3PE3000-1PQG208I is a ProASIC3E Field Programmable Gate Array (FPGA) offered in a 208-BFQFP surface-mount package. It provides a combination of high logic capacity, on-chip memory, and a substantial I/O count suitable for complex programmable logic tasks.

Key on-device resources include 75,264 logic elements, approximately 0.52 Mbits of embedded memory, 147 user I/Os and a gate capacity of 3,000,000—all delivered in an industrial-grade device specified for operation from -40 °C to 100 °C with a supply voltage range of 1.425 V to 1.575 V.

Key Features

  • Logic Elements – 75,264 logic elements provide a large programmable fabric for implementing complex digital functions.
  • Embedded Memory – Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for buffering, state storage and small data structures.
  • I/O Density – 147 user I/Os to support multiple peripheral interfaces and board-level connectivity.
  • Gate Capacity – 3,000,000 gates for substantial logic integration within a single device.
  • Power Supply – Operates from 1.425 V to 1.575 V to match system-level power requirements.
  • Package & Mounting – 208-BFQFP (208-PQFP, 28 × 28) in a surface-mount form factor for standard PCB assembly.
  • Temperature & Grade – Industrial-grade device rated for -40 °C to 100 °C operation, suitable for demanding thermal environments.
  • RoHS Compliant – Meets RoHS requirements for materials compliance.

Unique Advantages

  • High logic density: 75,264 logic elements and 3,000,000 gates enable consolidation of substantial digital functions into a single FPGA, reducing board-level component count.
  • Embedded memory on-chip: Approximately 0.52 Mbits of RAM provides local storage for state machines, buffers and small data sets without external memory.
  • Generous I/O capacity: 147 I/Os accommodate multiple interfaces and peripheral connections, simplifying routing and integration.
  • Industrial temperature range: Rated from -40 °C to 100 °C and specified as industrial grade for reliable operation in temperature-challenging environments.
  • Standard package and surface-mount assembly: 208-BFQFP (28 × 28) facilitates use with common PCB assembly processes and available footprints.
  • Controlled supply range: Narrow supply voltage specification (1.425 V to 1.575 V) enables predictable power planning and system-level consistency.

Why Choose M1A3PE3000-1PQG208I?

The M1A3PE3000-1PQG208I packs significant programmable logic, embedded memory and I/O resources into a single industrial-grade FPGA package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of on-chip RAM and 147 I/Os makes it well suited to designs that require high integration, predictable power behavior and operation across a wide temperature range.

Choose this ProASIC3E FPGA when your project demands consolidated digital functionality, robust thermal performance and a surface-mount hardware footprint backed by RoHS compliance.

Request a quote or submit an inquiry for M1A3PE3000-1PQG208I to receive pricing and availability information.

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