M1A3PE3000-1PQG208I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP |
|---|---|
| Quantity | 1,135 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of M1A3PE3000-1PQG208I – ProASIC3E Field Programmable Gate Array (FPGA) IC 147 516096 208-BFQFP
The M1A3PE3000-1PQG208I is a ProASIC3E Field Programmable Gate Array (FPGA) offered in a 208-BFQFP surface-mount package. It provides a combination of high logic capacity, on-chip memory, and a substantial I/O count suitable for complex programmable logic tasks.
Key on-device resources include 75,264 logic elements, approximately 0.52 Mbits of embedded memory, 147 user I/Os and a gate capacity of 3,000,000—all delivered in an industrial-grade device specified for operation from -40 °C to 100 °C with a supply voltage range of 1.425 V to 1.575 V.
Key Features
- Logic Elements – 75,264 logic elements provide a large programmable fabric for implementing complex digital functions.
- Embedded Memory – Approximately 0.52 Mbits (516,096 bits) of on-chip RAM for buffering, state storage and small data structures.
- I/O Density – 147 user I/Os to support multiple peripheral interfaces and board-level connectivity.
- Gate Capacity – 3,000,000 gates for substantial logic integration within a single device.
- Power Supply – Operates from 1.425 V to 1.575 V to match system-level power requirements.
- Package & Mounting – 208-BFQFP (208-PQFP, 28 × 28) in a surface-mount form factor for standard PCB assembly.
- Temperature & Grade – Industrial-grade device rated for -40 °C to 100 °C operation, suitable for demanding thermal environments.
- RoHS Compliant – Meets RoHS requirements for materials compliance.
Unique Advantages
- High logic density: 75,264 logic elements and 3,000,000 gates enable consolidation of substantial digital functions into a single FPGA, reducing board-level component count.
- Embedded memory on-chip: Approximately 0.52 Mbits of RAM provides local storage for state machines, buffers and small data sets without external memory.
- Generous I/O capacity: 147 I/Os accommodate multiple interfaces and peripheral connections, simplifying routing and integration.
- Industrial temperature range: Rated from -40 °C to 100 °C and specified as industrial grade for reliable operation in temperature-challenging environments.
- Standard package and surface-mount assembly: 208-BFQFP (28 × 28) facilitates use with common PCB assembly processes and available footprints.
- Controlled supply range: Narrow supply voltage specification (1.425 V to 1.575 V) enables predictable power planning and system-level consistency.
Why Choose M1A3PE3000-1PQG208I?
The M1A3PE3000-1PQG208I packs significant programmable logic, embedded memory and I/O resources into a single industrial-grade FPGA package. Its combination of 75,264 logic elements, approximately 0.52 Mbits of on-chip RAM and 147 I/Os makes it well suited to designs that require high integration, predictable power behavior and operation across a wide temperature range.
Choose this ProASIC3E FPGA when your project demands consolidated digital functionality, robust thermal performance and a surface-mount hardware footprint backed by RoHS compliance.
Request a quote or submit an inquiry for M1A3PE3000-1PQG208I to receive pricing and availability information.

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