M1A3PE3000-2FG484
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 341 516096 484-BGA |
|---|---|
| Quantity | 763 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 341 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of M1A3PE3000-2FG484 – ProASIC3E FPGA (484-BGA)
The M1A3PE3000-2FG484 is a ProASIC3E field programmable gate array (FPGA) manufactured by Microchip Technology. It provides a mid-range programmable fabric with 75,264 logic elements and approximately 0.516 Mbits of embedded RAM, serving designs that require on-chip logic density, moderate embedded memory, and a high I/O count. Packaged in a 484-ball BGA and specified for commercial temperature operation, this device targets a range of general-purpose electronic designs.
Key Features
- Core Logic 75,264 logic elements (cells) providing the programmable fabric for custom digital functions and logic implementation.
- Embedded Memory 516,096 bits of on-chip RAM (approximately 0.516 Mbits) for buffering, small data tables, and state storage.
- I/O and Gate Capacity 341 user I/O pins and approximately 3,000,000 gates to support complex interfacing and logic requirements.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V to match system power-rail requirements.
- Package & Mounting 484-ball FPBGA package (23 × 23 mm footprint) in a surface-mount configuration for compact board integration.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Compliance RoHS compliant to support environmental and manufacturing requirements.
Unique Advantages
- High logic density: 75,264 logic elements enable substantial on-chip logic integration to reduce external components.
- Moderate embedded RAM: Approximately 0.516 Mbits of on-chip memory supports buffering and small data structures without external memory.
- Extensive I/O: 341 I/O pins accommodate numerous interfaces and peripherals directly on the FPGA.
- Compact BGA package: 484-ball FPBGA (23×23) provides a space-efficient form factor for high-density PCBs.
- Commercial temperature rating: Designed for standard commercial applications with operation from 0 °C to 85 °C.
- Manufacturer backing: Produced by Microchip Technology, offering a known supplier for procurement and lifecycle considerations.
Why Choose M1A3PE3000-2FG484?
The M1A3PE3000-2FG484 positions itself as a flexible mid-range FPGA option for designers needing significant logic resources, a high I/O count, and onboard RAM in a compact BGA package. Its combination of 75,264 logic elements, ~0.516 Mbits of embedded memory, and approximately 3 million gates makes it suitable for general-purpose digital integration where commercial temperature operation is acceptable.
Backed by Microchip Technology and RoHS compliant, this device is appropriate for development and production environments that prioritize compact packaging and high I/O capability while maintaining straightforward power and thermal requirements.
Request a quote or submit a purchasing inquiry for pricing and availability of the M1A3PE3000-2FG484 to receive a formal quotation and lead-time information.

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