M1A3PE3000-2FG896I
| Part Description |
ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA |
|---|---|
| Quantity | 1,660 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 620 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 75264 | Number of Logic Elements/Cells | 75264 | ||
| Number of Gates | 3000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of M1A3PE3000-2FG896I – ProASIC3E Field Programmable Gate Array (FPGA) IC 620 516096 896-BGA
The M1A3PE3000-2FG896I is a ProASIC3E field programmable gate array (FPGA) offering 75,264 logic elements, approximately 0.52 Mbits of embedded memory (516,096 total RAM bits) and a gate count of 3,000,000. The device exposes 620 user I/O pins and is supplied in an 896-BGA footprint (896-FBGA, 31×31) for surface-mount assembly.
Specified for industrial use, the device operates from −40 °C to 100 °C and supports a supply voltage range of 1.425 V to 1.575 V. The M1A3PE3000-2FG896I is RoHS compliant.
Key Features
- Core Logic — 75,264 logic elements and a 3,000,000-gate architecture provide substantive on-chip combinational and sequential resources for digital designs.
- Embedded Memory — Approximately 0.52 Mbits of embedded RAM (516,096 bits) for buffering, state storage, and local data handling.
- I/O Capacity — 620 user I/O pins to support high interface density and multiple external connections.
- Power Supply — Operates over a defined supply range of 1.425 V to 1.575 V.
- Package & Mounting — 896-BGA (supplier device package: 896-FBGA, 31×31) in a surface-mount format for dense PCB layouts.
- Temperature & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C.
- Compliance — RoHS compliant.
Unique Advantages
- High logic density: 75,264 logic elements and 3,000,000 gates enable consolidation of complex digital functions into a single device, reducing board-level component count.
- On-chip memory available: Approximately 0.52 Mbits of embedded RAM provides local storage for buffering and state machines, minimizing external memory requirements.
- Large I/O complement: 620 I/O pins support extensive peripheral and interface connections without external GPIO expanders.
- Industrial thermal performance: −40 °C to 100 °C rating supports deployment in a wide range of environmental conditions.
- Compact, high-density package: 896-FBGA (31×31) surface-mount package enables high-density PCB integration while preserving signal pin count.
- Regulatory readiness: RoHS compliance simplifies integration into lead-free manufacturing processes.
Why Choose M1A3PE3000-2FG896I?
The M1A3PE3000-2FG896I combines substantial logic resources, embedded memory, and a high I/O count in an industrial-grade FPGA package. Its defined supply voltage window and −40 °C to 100 °C operating range make it suitable for designs that require deterministic electrical and thermal operating points.
As a field programmable device in an 896-FBGA surface-mount package, it offers a compact platform for consolidating digital functionality and adapting designs through reprogramming across development cycles, helping simplify BOM and support design iteration.
Request a quote or submit a pricing request to obtain availability and lead-time information for the M1A3PE3000-2FG896I.
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