M1A3PE3000-2FG896

The M1A3PE3000-2FG896 is a ProASIC3E field programmable gate array (FPGA) designed for applications that require high logic density and a large I/O count. It integrates 75,264 logic elements and approximately 0.516 Mbits of embedded memory, packaged in a compact 896-ball FBGA (31×31) surface-mount package.

With a core supply range of 1.425 V to 1.575 V, commercial operating temperature range of 0 °C to 85 °C, and RoHS compliance, this device is suited to mainstream electronic designs that demand significant on-chip resources and flexible interfacing.

Key Features

• Logic Capacity  75,264 logic elements providing a total of 3,000,000 gates for complex programmable logic implementations.
• Embedded Memory  Approximately 0.516 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density  620 user I/O pins to support extensive peripheral interfacing and parallel connections.
• Package & Mounting  896-ball FBGA (31×31) package in a surface-mount form factor for high-density board integration.
• Power  Core voltage supply specified from 1.425 V to 1.575 V to meet targeted power and performance points.
• Temperature & Compliance  Commercial-grade operating range of 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• High-density I/O systems  Use where designs require extensive external connectivity—620 I/O pins enable multiple parallel interfaces and peripheral routing.
• On-chip memory-dependent logic  Ideal for designs that rely on embedded RAM for buffering, small FIFOs, or local data processing using approximately 0.516 Mbits of memory.
• Complex programmable logic  Applies to designs requiring substantial logic resources—75,264 logic elements and 3,000,000 gates for implementing intricate state machines and custom functions.

Unique Advantages

• High logic density: 75,264 logic elements and 3,000,000 gates enable implementation of large-scale logic functions within a single device.
• Significant on-chip memory: Approximately 0.516 Mbits of embedded RAM reduces dependence on external memory for moderate buffering and local storage needs.
• Extensive I/O capability: 620 I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing board-level complexity.
• Compact, manufacturable package: 896-FBGA (31×31) surface-mount package supports high-density PCB layouts while maintaining robust solderability.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for standard commercial product deployments.
• Defined core supply range: 1.425 V to 1.575 V provides clear power requirements for system power-supply design and validation.

Why Choose M1A3PE3000-2FG896?

The M1A3PE3000-2FG896 delivers substantial on-chip resources—logic, memory, and I/O—in a single, RoHS-compliant FPGA package. Its combination of 75,264 logic elements, approximately 0.516 Mbits of embedded RAM, and 620 I/O pins makes it well suited for designs that need dense programmable logic and broad interfacing without relying on multiple devices.

This device is targeted at designers and procurement teams seeking a commercially rated FPGA offering clear power and temperature specifications, compact packaging, and the capacity to consolidate complex logic functions—helping to reduce board-level parts count and simplify system architecture.

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