M1A3PE3000-2FGG324

The M1A3PE3000-2FGG324 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-range programmable logic solution featuring 75,264 logic elements (LEs), roughly 3,000,000 gates and approximately 0.52 Mbits of embedded memory, designed for surface-mount integration in a 324-ball BGA package.

With 221 I/O pins, a narrow supply voltage range of 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C, this device is suited to designs that require substantial logic density, abundant I/O and compact board-level packaging.

Key Features

• Core Logic  Contains 75,264 logic elements and approximately 3,000,000 gates to implement mid-size programmable logic designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for buffering, small lookup tables and local data storage.
• I/O Capability  221 user I/O pins support extensive external interfacing and signal routing on a single device.
• Package and Mounting  324-ball FBGA (19 × 19) surface-mount package provides a compact, high-density footprint for space-constrained PCBs.
• Power  Operates from a supply voltage between 1.425 V and 1.575 V, enabling predictable power-domain design.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard embedded applications.
• Compliance  RoHS compliant.

Typical Applications

• I/O-Intensive Systems  Boards that require high pin counts for interface bridging or peripheral aggregation can leverage the device’s 221 I/O pins.
• Mid-Size Programmable Logic  Designs needing tens of thousands of logic elements and millions of gates for custom control, data-path or glue logic implementations.
• Compact, High-Density PCB Designs  The 324-BGA package enables dense placement and small form-factor assemblies where board space is limited.
• On-Chip Buffering and Local Memory  Applications that require local storage for small buffers or lookup tables can utilize the on-chip RAM resources.

Unique Advantages

• High Logic Density:  75,264 logic elements and roughly 3,000,000 gates provide substantial programmable capacity for mid-range designs.
• Generous I/O Count:  221 I/O pins simplify system integration by reducing external multiplexing or glue logic.
• Compact Packaging:  324-FBGA (19 × 19) surface-mount package minimizes board area while supporting high pin counts.
• Predictable Power Envelope:  A defined supply range of 1.425 V to 1.575 V helps streamline power delivery design and validation.
• Commercial Temperature Rating:  0 °C to 85 °C operation aligns with standard embedded and consumer product requirements.
• RoHS Compliant:  Meets current lead-free and hazardous substances requirements for environmental compliance.

Why Choose M1A3PE3000-2FGG324?

The M1A3PE3000-2FGG324 positions itself as a compact, mid-range FPGA option from Microchip Technology, combining substantial logic capacity, on-chip RAM and a high I/O count in a space-efficient BGA package. It is well suited to engineers and teams developing embedded systems that require significant programmable logic resources and dense I/O in a commercial-temperature application.

Choosing this device provides a balance of integration and board-level efficiency for designs that must consolidate logic, interface multiple signals and maintain a small PCB footprint, all while relying on an established semiconductor supplier.

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